Characterizations of the interfacial energy in glass/resin laminates

International Journal of Precision Engineering and Manufacturing

Volumn 12, Issue 6, 2011, Pages 1079-1084

  Park, Jae Hong ^a   Kim, Tae Woo ^a   Yim, Hong Jae ^a   Lee, Kee Sung ^a  

^a Kookmin University   (South Korea)

Author keywords

Demolding; Interface energy; Laminate; Nanoimprint

Indexed keywords

EID: 83255173910     PISSN: 12298557     EISSN: None     Source Type: Journal    
DOI: 10.1007/s12541-011-0144-2     Document Type: Article

References (25)

1. Ortiz, C. and Boyce, M. C., Bioinspired structural materials, Science, Vol. 319, No. 5866, pp. 1053-1054, 2008.
2. Lawn, B., Bhowmick, S., Bush, M. B., Qasim, T., Rekow, E. D. and Zhang, Y., Failure Modes in Ceramic-Based Layer Structures: A Basis for Materials Design of Dental Crowns, Journal of the American Ceramic Society, Vol. 90, No. 6, pp. 1671-1683, 2007.
3. Tang, H., Barthelat, F. and Espinosa, H. D., An elastoviscoplastic interface model for investigating the constitutive behavior of nacre, Journal of the Mechanics and Physics of Solids, Vol. 55, No. 7, pp. 1410-1438, 2007.
4. Barthelat, F., Tang, H., Zavattieri, P. D., Li, C.-M. and Espinosa, H. D., On the mechanics of mother-of-pearl: A key feature in the material hierarchical structure, Journal of the Mechanics and Physics of Solids, Vol. 55, No. 2, pp. 306-337, 2007.
5. Flocker, F. W. and Dharani, L. R., Stresses in laminated glass subject to low velocity impact, Engineering Structures, Vol. 19, No. 10, pp. 851-856, 1997.
6. Wei, J. and Dharani, L. R., Fracture mechanics of laminated glass subjected to blast loading, Theoretical and Applied Fracture Mechanics, Vol. 44, No. 2, pp. 157-167, 2005.
7. Ivanov, I. V., Analysis, modelling, and optimization of laminated glasses as plane beam, International Journal of Solids and Structures, Vol. 43, No. 22-23, pp. 6887-6907, 2006.
8. Naslain, R., Design, preparation and properties of non-oxide CMCs for application in engines and nuclear reactors: an overview, Composites Science and Technology, Vol. 64, No. 2, pp. 155-170, 2004.
9. Yoshida, K., Matsukawa, K., Imai, M. and Yano, T., Formation of carbon coating on SiC fiber for two-dimensional SiCf/SiC composites by electrophoretic deposition, Materials Science and Engineering: B, Vol. 161, No. 1-3, pp. 188-192, 2009.
10. Jang, K. S., Lee, E., Kim, T. W., Han, I. S., Woo, S. K. and Lee, K. S., Mechanical behavior of SiCf reinforced SiC composites with fiber coating - Stress alleviation in SiC fiber by soft coating layer, Journal of the Ceramic Society of Japan, Vol. 117, No. 5, pp. 582-587, 2009.
11. Chou, S. Y., Krauss, P. R. and Renstrom, P. J., Imprint Lithography with 25-Nanometer Resolution, Science, Vol. 272, No. 5258, pp. 85-87, 1996.
12. Schueller, O. J. A., Brittain, S. T. and Whitesides, G. M., Fabrication of glassy carbon microstructures by soft lithography, Sensors and Actuators A: Physical, Vol. 72, No. 2, pp. 125-139, 1999.
13. Choi, B. J., Sreenivasan, S. V., Johnson, S., Colburn, M. and Wilson, C. G., Design of orientation stages for step and flash imprint lithography, Journal of the International Societies for Precision Engineering and Nanotechnology, Vol. 25, No. 3, pp. 192-199, 2001.
14. Lan, H., Ding, Y., Liu, H. and Lu, B., Review of the wafer stage for nanoimprint lithography, Microelectronic Engineering, Vol. 84, No. 4, pp. 684-688, 2007.
15. Hsueh, C. H., Lee, S., Lin, H. Y., Chen, L. S. and Wang, W. H., Analyses of mechanical failure in nanoimprint processes, Materials Science and Engineering: A, Vol. 433, No. 1-2, pp. 316-322, 2006.
16. Park, I. S., Lim, S. H., Shin, D. H., Lee, K. S., Jang, S., Yim, H. J., Won, C. and Jeong, J. I., Heat transfer analysis during a curing process for UV nanoimprint lithography, Journal of Mechanical Science and Technology, Vol. 23, No. 4, pp. 927-930, 2009.
17. Bocciarelli, M. and Maier, G., Indentation and imprint mapping method for identification of residual stresses, Computational Materials Science, Vol. 39, No. 2, pp. 381-392, 2007.
18. Bocciarelli, M. and Bolzon, G., Indentation and imprint mapping for the identification of constitutive parameters of thin layers on substrate: Perfectly bonded interfaces, Materials Science and Engineering: A, Vol. 448, No. 1-2, pp. 303-314, 2007.
19. Ryu, R. H., Lim, S. H., Jeong, J. I., Shin, D. H., Jang, S., Yim, H. J. and Lee, K. S., Theoretical and experimental analysis of material deformation by microcontact, Int. J. Precis. Eng. Manuf., Vol. 10, No. 2, pp. 111-116, 2009.
20. Bailey, T., Choi, B. J., Colburn, M., Meissl, M., Shaya, S., Ekerdt, J. G., Sreenivasan, S. V. and Willson, C. G., Step and flash imprint lithography: Template surface treatment and defect analysis, Journal of Vacuum Science and Technology B, Vol. 18, No. 6, pp. 3572-3577, 2000.
21. Mayer, T. M., Boer, M. P., Shinn, N. D., Clews, P. J. and Michalske, T. A., Chemical vapor deposition of fluoroalkylsilane monolayer films for adhesion control in microelectromechanical systems, Journal of Vacuum Science and Technology B, Vol. 18, No. 5, pp. 2433-2440, 2000.
22. Kim, J. Y., Choi, D. G., Jeong, J. H. and Lee, E. S., UV-curable nanoimprint resin with enhanced anti-sticking property, Applied Surface Science, Vol. 254, No. 15, pp. 4793-4796, 2008.
23. Trabadelo, V., Schift, H., Merino, S., Bellini, S. and Gobrecht, J., Measurement of demolding forces in full wafer thermal nanoimprint, Microelectronic Engineering, Vol. 85, No. 5-6, pp. 907-909, 2008.
24. Charalambides, P. G., Lund, J., Evans, A. G. and McMeeking, R. M., A test specimen for determining the fracture resistance of biomaterial interfaces, Journal of Applied Mechanics, Vol. 56, No. 1, pp. 77-82, 1989.
25. Kingery, W. D., Bowen, H. K. and Uhlmann, D. R., Introduction to Ceramics, John Wiley & Sons, pp. 185-187, 1976.