Gentle cold welding between gold nano objects driven by electrical field and atomic rearrangement

Journal of Applied Physics

Volumn 110, Issue 10, 2011, Pages

  Ishida, Tadashi ^a   Kakushima, Kuniyuki ^b   Fujita, Hiroyuki ^a  

^a INSTITUTE OF INDUSTRIAL SCIENCE   (Japan)

^b TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC REARRANGEMENTS; BOTTOM UP APPROACH; BOTTOM-UP FABRICATION; ELECTRICAL FIELD; FIELD EVAPORATION; GOLD SURFACES; KEY TECHNOLOGIES; NANO DEVICE; NANO-OBJECTS; PHYSICAL CONTACTS; SELF-DIFFUSION; SINGLE-CRYSTALLINE STRUCTURES; TOP-DOWN APPROACH; TOPDOWN; TRANSMISSION ELECTRON MICROSCOPE; WELDING METHOD;

COLD WELDING; GOLD; TRANSMISSION ELECTRON MICROSCOPY; WELDING;

ATOMS;

EID: 82555165234     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3662180     Document Type: Conference Paper

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