Novel stress measurement system for evaluation of package induced stress

Smart Systems Integration 2008 - 2nd European Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, MOEMS, ICs and Electronic Components, SSI 2008

Volumn , Issue , 2008, Pages

  Kittel, Hartmut ^a   Endler, Stefan ^a   Osterwinter, Heinz ^b   Oesterle, Sonja ^c   Schindler Saefkow, Florian ^d  

^a ROBERT BOSCH GMBH   (Germany)

^b TransferZentrum Mikroelektronik   (Germany)

^c Department of Marketing and Corporate Communication   (Germany)

^d FRAUNHOFER IZM   (Germany)

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EID: 84978221014     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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