A synchrotron radiation X-ray microdiffraction study on orientation relationships between a Cu6Sn5 and Cu substrate in solder joints

JOM

Volumn 58, Issue 6, 2006, Pages 63-66

  Suh, J O ^a   Tu, K N ^a   Tamura, N ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

LAUE SPOTS; SCALLOPS; SYNCHROTRON-RADIATION-BASED MICRO X-RAY DIFFRACTION;

COPPER ALLOYS; CRYSTAL ORIENTATION; GROWTH KINETICS; SUBSTRATES; SYNCHROTRON RADIATION; TEXTURES; TIN ALLOYS; X RAY DIFFRACTION ANALYSIS;

SOLDERED JOINTS;

EID: 33745289762     PISSN: 10474838     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11837-006-0185-7     Document Type: Article

References (10)

1. H.K. Kim, K.N. Tu, and P.A. Totta, Appl. Phys. Lett., 68 (16) (1996), p. 2204.
2. K.N. Tu and K. Zeng, Mat. Sci. Eng., R 34 (1) (2001), p. 1.
3. D.R. Frear at al., JOM, 53 (6) (2001), pp. 28-32, 38.
4. J.W. Nah at al., J. Appl. Phys., 94 (12) (2003), p. 7560.
5. A.M. Gusak and K.N. Tu, Phys. Rev. B, 66 (11) (2002), p. 115403.
6. J.O. Suh, K.N.Tu, and A.M. Gusak, Proc. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (Piscataway, NJ: IEEE, 2005), pp. 27-32.
7. ASM, Metals Handbook, 9th ed., vol. 9 (Metals Park, OH: America Society for Metals, 1985).
8. N. Tamura et al., Rev. Sci. Instrum., 73 (3) (2002), p. 1369.
9. A. Gangulee, G.C. Das, and M.B. Bever, Metall. Trans., 4 (9) (1973), p. 2063.
10. P.L. Brooks and E. Gillam, Acta Metall., 18 (11) (1970), p. 1181.