Temperature enhanced large area nano transfer printing on Si/SiO 2 substrates using si wafer stamps

Journal of Adhesion

Volumn 87, Issue 9, 2011, Pages 893-901

  Bareiss, Mario ^a   Imtaar, Muhammad Atyab ^a   Fabel, Bernhard ^a   Scarpa, Giuseppe ^a   Lugli, Paolo ^a  

^a TECHNICAL UNIVERSITY OF MUNICH   (Germany)

Author keywords

Adhesion; Aluminum; Large area; Metal transfer; Nano transfer printing; Permalloy; Silanol; Titanol

Indexed keywords

LARGE AREA; METAL TRANSFER; PERMALLOY; SILANOLS; TITANOL; TRANSFER PRINTING;

ADHESION; ALUMINUM; ELECTRON BEAMS; METAL PRESSING; METALS; PRINTING; SEMICONDUCTING SILICON COMPOUNDS; SILICON OXIDES; SILICON WAFERS;

SUBSTRATES;

EID: 80052622868     PISSN: 00218464     EISSN: 15455823     Source Type: Journal    
DOI: 10.1080/00218464.2011.600670     Document Type: Article

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