From embedded sensors to sensorial materials - The road to function scale integration

Sensors and Actuators, A: Physical

Volumn 171, Issue 1, 2011, Pages 3-11

  Lang, Walter ^a   Jakobs, Frank ^a   Tolstosheeva, Elena ^a   Sturm, Hannes ^a   Ibragimov, Azat ^a   Kesel, Antonia ^b   Lehmhus, Dirk ^a   Dicke, Ursula ^a  

^a UNIVERSITY OF BREMEN   (Germany)

^b HOCHSCHULE BREMEN   (Germany)

Author keywords

Hybrid integration; Sensor integration; Sensorial material

Indexed keywords

COMPUTING DEVICES; EMBEDDED SENSORS; HOST MATERIALS; HUMAN HANDS; HYBRID INTEGRATION; NEW SOLUTIONS; SCALE INTEGRATION; SENSOR EMBEDDING; SENSOR INTEGRATION; SENSORIAL MATERIAL; TECHNOLOGICAL APPLICATIONS;

HYBRID MATERIALS; INTEGRATION; SENSORS; SOUND INSULATING MATERIALS; UBIQUITOUS COMPUTING;

INTEGRAL EQUATIONS;

EID: 80052304865     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2011.03.061     Document Type: Conference Paper

References (51)

1. E. Brinksmeier, and L. Meyer Schleifprozessüberwachung mit sensorbestückten werkzeugen F. Klocke, G. Pritschow, Autonome Produktion 2004 Springer 81 90
2. E. Brinksmeier, C. Heinzel, A. Wilkens, W. Lang, and T. Seedorf Monitoring of machining processes using sensor equipped tools Advanced Engineering Materials 12 7 2010 641 645 10.1002/adem.200900312 URL: http://dx.doi.org/10.1002/adem.200900312
3. W.A. Müller Tier- und Humanphysiologie. Ein einführendes Lehrbuch 2nd edition 2003 Springer-Verlag GmbH
4. E.R. Kandel, J.H. Schwartz, and T.M. Jessell Principles of Neural Science 4th edition 2000 Mcgraw-Hill Professional
5. B. Hoefflinger High-Dynamic-Range (HDR) Vision, no 26 2007 Springer Berlin Heidelberg Berlin, Heidelberg
6. P. French, and P. Sarro To integrate or not to integrate Proc. IEEE Sensors 2010 2179 2185
7. A.S.G. Reddy, B.B. Narakathu, M. Atashbar, M. Rebros, and E.H.M. Joyce Printed electrochemical based biosensors on flexible substrates Proc. IEEE Sensors 2010 1596 1600
8. V. Zöllmer, M. Müller, M. Renn, M. Busse, Printing with aerosoles: a maskless deposition technique allows high definition printing of a variety of functional materials, European Coatings Conference "The Power of Ink-Jet Materials III".
9. L. Mädler, A.A. Lall, and S.K. Friedlander One-step aerosol synthesis of nanoparticle agglomerate films: simulation of film porosity and thickness Nanotechnology 17 19 2006 4783
10. B.-A. Behrens, M. Kamp, O. Pösse, K. Weilandt, Smart materials - intelligent components by means of metal forming, Steel grips.
11. B.-A. Behrens, K. Weilandt, K. Voges-Schwieger, and M. Kamp The alpha - martensite evolution - mathematical formulation and application to an early detection of damage in sheet metal components Proceedings of the 6th European Stainless Steel Conference Science and Market 2008
12. A. Fuchs What it takes to make it work: The onvu tti Coldchain Management, 3rd International Workshop 2010
13. S. Lindsay Introduction to Nanoscience 2010 Oxford University Press
14. A. Ulman Ultrathin Organic Films 1991 Academic Press San Diego
15. Y.X. Zhuang, O. Hansen, T. Knieling, C. Wang, P. Rombach, W. Lang, W. Benecke, M. Kehlenbeck, and J. Koblitz Thermal stability of vapor phase deposited self-assembled monolayers for mems anti-stiction Journal of Micromechanics and Microengineering 16 2006 2259 2264 (Pubitemid 44679443)
16. P. Rothmunde Folding dna to create nanoscale shapes and patterns Nature 2006 297 302
17. T. Schary, M. Meiners, W. Lang, and W. Benecke Fused silica as substrate material for surface micromachined capacitive pressure sensors operable in touch-mode Proceedings of the IEEE Sensors'05 Conference (accepted oral) Irvine, USA 2005 1 5
18. R. Buchner, K. Froehner, C. Sosna, W. Benecke, and W. Lang Toward flexible thermoelectric flow sensors: a new technological approach Journal of Microelectromechanical Systems 17 5 2008 1114 1119
19. J. Burghartz Ultra-Thin Chip Technology and Applications 2011 Springer New York
20. H. Sturm, K. Froehner, E. Brauns, R. Buchner, and W. Lang Flexible thermoelectric flow sensors - an integration of sensorial layers on polymers EMRS Spring Meeting 2010 Strasbourg 2010
21. H. Sturm, and W. Lang Thin chip flow sensors for non-planar assembly J. Burghartz, Ultra-thin Chip Technology and Applications 2011 377 388
22. H. Sturm, E. Brauns, K. Froehner, W. Lang, and R. Buchner Thermoelectric flow sensors on flexible substrates and their integration process Proc. IEEE Sensors 2010 575 579
23. R. Buchner, C. Sosna, M. Maiwald, W. Benecke, and W. Lang A high-temperature thermopile fabrication process for thermal flow sensors Sensors and Actuators A: Physical 130-131 2006 262 266 (Pubitemid 44037361)
24. C. Pille, F. Wśostmann, H. Pleteit, M. Heuser, Method and device for manufactoring a component with integrated insert section (2010).
25. C. Pille In process embedding of piezo sensors and rfid transponders into cast parts for autonomous manufacturing logistics Proceedings of Smart Systems Integration 2010
26. H. Sandmaier, H.L. Offereins, K. Kuhl, and W. Lang Corner compensation techniques in anisotropic etching of (100)-silicon using aqueous koh Proc. Int Solid-State Sensors and Actuators Digest of Technical Papers, TRANSDUCERS'91. Conf. 1991 456 459
27. U. Buder, R. Petz, M. Kittel, W. Nitsche, and E. Obermeier Aeromems polyimide based wall double hot-wire sensors for flow separation detection Sensors and Actuators A: Physical 142 1 2008 130 137 (special Issue: Eurosensors XX The 20th European conference on Solid-State Transducers - Eurosensors 2006, Eurosensors 20th Edition) (Pubitemid 351210646)
28. B. Rubehn, C. Bosman, R. Oostenveld, P. Fries, and T. Stieglitz A mems-based flexible multichannel ecog-electrode array Journal of Neural Engineering 6 3 2009 036003
29. V.L. Spiering, S. Bouwstra, and R.M.E.J. Spiering On-chip decoupling zone for package-stress reduction Sensors and Actuators A: Physical 39 2 1993 149 156
30. Q.B. Zou, Z.F. Wang, R.M. Lin, S. Yi, H.Q. Gong, M.K. Lim, Z.J. Li, and L.T. Liu A study on corrugated diaphragms for high-sensitivity structures Journal of Micromechanics and Microengineering 7 4 1997 310 315 (Pubitemid 127611846)
31. T. Someya, Y. Kato, T. Sekitani, S. Iba, Y. Noguchi, Y. Murase, H. Kawaguchi, and T. Sakurai Conformable, flexible, large-area networks of pressure and thermal sensors with organic transistor active matrixes Proceedings of the National Academy of Sciences of the United States of America 102 35 2005 12321 12325 (Pubitemid 41266357)
32. S.P Lacour, Z. Huang, Z. Suo, and S. Wagner Deformable interconnects for conformal integrated circuits, Electronics on Unconventional Substrates - Electrotextiles and Giant-Area Flexible Circuits Symposium (Mater. Res. Soc. Symposium Proceedings Vol.736) 2003 183 188
33. M. Gonzalez, F. Axisa, M. Vanden Bulcke, D. Brosteaux, B. Vandevelde, and J. Vanfleteren Design of metal interconnects for stretchable electronic circuits using finite element analysis Proc. Int. Conf. Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems EuroSime 2007 2007 1 6
34. S. Rosset, M. Niklaus, P. Dubois, and H.R. Shea Metal ion implantation for the fabrication of stretchable electrodes on elastomers Advanced Functional Materials 19 3 2009 470 478
35. P. Wei, R. Taylor, Z. Ding, G. Higgs, J.J. Norman, B.L. Pruitt, and B. Ziaie A stretchable cell culture platform with embedded electrode array 2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems. MEMS 2009 2009 407 410 10.1109/MEMSYS.2009.4805405
36. W.M. Choi, J. Song, D.-Y. Khang, H. Jiang, Y.Y. Huang, and J.A. Rogers Biaxially stretchable "wavy" silicon nanomembranes Nano Letters 7 6 2007 1655 1663 (Pubitemid 47140440)
37. D.H. Kim, and J.A. Rogers Stretchable electronics: materials strategies and devices Advanced Materials 20 24 2008 4887 4892
38. T.-Y. Kuo, Y.-C. Shih, Y.-C. Lee, H.-H. Chang, Z.-C. Hsiao, C.-W. Chiang, S.-M. Li, Y.-J. Hwang, C.-T. Ko, and Y.-H. Chen Flexible and ultra-thin embedded chip package Proc. 59th Electronic Components and Technology Conf. ECTC 2009 2009 1749 1753
39. J. Govaerts, W. Christiaens, E. Bosman, and J. Vanfleteren Fabrication processes for embedding thin chips in flat flexible substrates IEEE Transactions on Advanced Packaging 32 1 2009 77 83
40. W. Li, D.C. Rodger, E. Meng, J.D. Weiland, M.S. Humayun, and Y.-C. Tai Wafer-level parylene packaging with integrated rf electronics for wireless retinal prostheses Journal of Microelectromechanical Systems 19 4 2010 735 742
41. H. Pristauz Rfid chip assembly for 0.1 cent? Advanced Packaging 14 11 2005 21 22 (Pubitemid 41812044)
42. H. Sturm, C. Sosna, R. Buchner, C. Werner, D. Godlinski, V. Zoellmer, M. Busse, and W. Lang New electrical connection technology for microsystems using inktelligent printing and functional nanoscaled inks International Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009 2009 1702 1705
43. D. Gould, M. Meiners, W. Benecke, and W. Lang Condensation detection using a wirelessly powered rf-temperature sensor IEEE Transactions on Vehicular Technology 58 4 2009 1667 1672
44. S.D.O. Driscol A mm-sized implantable power receiver with adaptive matching Proc. IEEE Sensors 2010 83 86
45. C. Breckenfelder, D. Mrugala, C. An, A. Timm-Giel, C. Görg, O. Herzog, and W. Lang A cognitive glove sensor network for fire fighters 5th Workshop on "Artificial Intelligence Techniques for Ambient Intelligence" (AITAmI10) Kuala Lumpur, Malaysia 2010
46. T. Loher, R. Vieroth, M. Seckel, A. Ostmann, and H. Reichl Stretchable electronic systems for wearable and textile applications Proc. IEEE 9th VLSI Packaging Workshop of Japan VPWJ 2008 2008 9 12
47. L. Beccai, S. Roccella, L. Ascari, P. Valdastri, A. Sieber, M.C. Carrozza, and P. Dario Development and experimental analysis of a soft compliant tactile microsensor for anthropomorphic artificial hand IEEE/ASME Transactions on Mechatronics 13 2 2008 158 168 (Pubitemid 351649901)
48. G. Vásárhelyi, M. Ádám, É. Vázsonyi, I. Bársony, and C. Dücso Effects of the elastic cover on tactile sensor arrays Sensors and Actuators A: Physical 132 1 2006 245 251 (The 19th European Conference on Solid-State Transducers) (Pubitemid 44764943)
49. Y. Mukaibo, H. Shirado, M. Konyo, and T. Maeno Development of a texture sensor emulating the tissue structure and perceptual mechanism of human fingers Proceedings of the 2005IEEE International Conference on Robotics and Automation 2005 2565 2570 (Pubitemid 46084174)
50. X. Chen, J. Sakai, S. Yang, and S. Motojima Biomimetic tactile sensors with fingerprint-type surface made of carbon microcoils/polysilicone Japanese Journal of Applied Physics 45 37 2006 L1019 L1021
51. R.S. Dahiya, G. Metta, M. Valle, and G. Sandini Tactile sensing - from humans to humanoids IEEE Transactions on Robotics 26 1 2010 1 20