Thermoelectric flow sensors on flexible substrates and their integration process

Proceedings of IEEE Sensors

Volumn , Issue , 2010, Pages 575-579

  Sturm, H ^a   Brauns, E ^a   Froehner, K ^a   Lang, W ^a   Buchner, R ^b  

^a UNIVERSITY OF BREMEN   (Germany)

^b DANFOSS A S   (Denmark)

Author keywords

[No Author keywords available]

Indexed keywords

FABRICATION PROCESS; FLEXIBLE FLOW; FLEXIBLE SUBSTRATE; FLIP-CHIP MOUNTING; FLOW CHANNELS; FLOW-SENSORS; FUNCTIONAL LAYER; INTEGRATION PROCESS; MASS FLOW RATE; MECHANICAL CHARACTERISTICS; MEMS TECHNOLOGY; NON-PLANAR SURFACES; POLYMER FOIL; SILICON SUBSTRATES; SYSTEM INTEGRATION; WAFER THICKNESS;

POLYIMIDES; SILICON WAFERS; SUBSTRATES;

SENSORS;

EID: 79951917711     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICSENS.2010.5690470     Document Type: Conference Paper

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