Flexible and ultra-thin embedded chip package

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 1749-1753

  Kuo, Tzu Ying ^a   Shih, Ying Ching ^a   Lee, Yuan Chang ^a   Chang, Hsiang Hung ^a   Hsiao, Zhi Cheng ^a   Chiang, Chia Wen ^a   Li, Shu Man ^a   Hwang, Yu Jiau ^a   Ko, Cheng Ta ^a   Chen, Yu Hua ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BUILD-UP LAYERS; CARRIER SUBSTRATE; CHIP PACKAGES; CHIP TECHNOLOGY; CURVATURE RADII; ELECTRICAL INTERCONNECTIONS; FLEXIBLE PACKAGES; FLEXIBLE SUBSTRATE; KEY TOPICS; LAMINATION PROCESS; MECHANICAL GRINDING; METALLIZATIONS; NOVEL PROCESS; PATTERNING PROCESS; PLASMA TREATMENT; SEMICONDUCTOR CHIPS; STATIC AND DYNAMIC; ULTRA-THIN; ULTRA-THIN CHIPS; VIA DRILLING;

BENDING TESTS; GRINDING (COMMINUTION); GRINDING (MACHINING); MECHANICAL PROPERTIES; PLASMA APPLICATIONS; POLYIMIDES; SUBSTRATES; TECHNOLOGY;

PACKAGING;

EID: 70349655232     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074252     Document Type: Conference Paper

References (7)

1. th Electronic Components and Technology Conf, May. 2006, pp. 1836-1840.
2. th Electronic Components and Technology Conf, May. 2008, pp. 1287 - 1293.
3. th Electronic Components and Technology Conf, May. 2008, pp. 1110-1116.
4. Thomas Löher, et al., "Highly integrated flexible electronic Circuits and Modules, " 3rd IMPACT and 10th EMAP Joint Conf, Oct. 2008, pp. 137-141.
5. W. Christiaens, et al., "UTCP: 60 μm Thick Bendable Chip Package", Proceedings of IWLPC, Nov. 2006.
6. W. Christiaens, et al., "Functionality and reliability testing of Bendable Ultrathin Chip Packages", Proc. IMAPS Nordic Conf., 2008.
7. th Electronic Components and Technology Conf, May 2006, pp. 322-329.