New electrical connection technology for microsystems using Inktelligent Printing® and functional nanoscaled inks

TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems

Volumn , Issue , 2009, Pages 1702-1705

  Sturm, H ^a   Sosna, C ^a   Buchner, R ^a   Werner, C ^b   Godlinski, D ^b   Zollmer V ^b   Busse, M ^b   Lang, W ^a  

^a UNIVERSITY OF BREMEN   (Germany)

^b FRAUNHOFER INSTITUTE FOR MANUFACTURING TECHNOLOGY AND ADVANCED MATERIALS IFAM   (Germany)

Author keywords

Conductive inks; Functional printing; Nanoparticles; Nanoscaled inks

Indexed keywords

AEROSOL BEAM; ASSEMBLED SYSTEM; CONDUCTIVE INK; ELECTRICAL CONNECTION TECHNOLOGY; ELECTRICAL CONTACTS; ELECTRICALLY CONDUCTIVE INKS; FLIP CHIP; FLOW-SENSORS; FUNCTIONAL NANOPARTICLES; FUNCTIONAL PRINTING; LARGE DIMENSIONS; LONG TERM STABILITY; MASK LESS; MATERIAL DEPOSITION; MEMSDEVICES; MESOSCALE; MICROMETER SIZES; MINIATURIZED SYSTEMS; NANOSCALED; NANOSCALED INKS; PACKAGING TECHNOLOGIES; TEMPERATURE DEPENDENCIES; WIRE BONDING;

ACTUATORS; ATMOSPHERIC AEROSOLS; ELECTRIC CONNECTORS; INK; MICROSYSTEMS; NANOPARTICLES; PIEZOELECTRIC TRANSDUCERS; PRINTING; PRINTING MACHINERY; TECHNOLOGY;

SOLID-STATE SENSORS;

EID: 71449094988     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2009.5285760     Document Type: Conference Paper

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