The lifetime comparison of Ni and Ni-PTFE moulding inserts with high aspect-ratio structure

Microsystem Technologies

Volumn 11, Issue 4-5, 2005, Pages 261-264

  Tian, Y ^a   Zhang, P ^a   Liu, G ^a   Tian, X ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ASPECT RATIO; ELECTROFORMING; FRICTION; INTERFACIAL ENERGY; METAL MOLDING; MICROSTRUCTURE; NICKEL; POLYTETRAFLUOROETHYLENES; SCANNING ELECTRON MICROSCOPY; THERMOPLASTICS; X RAY LITHOGRAPHY;

FRICTIONAL FORCES; HOT EMBOSSING PROCESS; LIGA TECHNIQUE; MICROMOLDING;

SHEET MOLDING COMPOUNDS;

EID: 21044453170     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-004-0404-5     Document Type: Conference Paper

References (7)

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