Numerical analyses of peel demolding for UV embossing of high aspect ratio micro-patterning

Microsystem Technologies

Volumn 15, Issue 4, 2009, Pages 581-593

  Yeo, L P ^a,b   Joshi, S C ^c   Lam, Y C ^a,c   Chan Park, Mary B ^a,d   Hardt, D E ^a,e  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^c NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^d Nanyang Technological University   (Singapore)

^e Massachusetts Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; DIMENSIONAL STABILITY; MOLDS; PHOTORESISTS; POLYMERS; PRESSURE DROP; SHRINKAGE;

COHESIVE-ZONE MODELING; CROSS-LINKED POLYMERS; DEMOLDING; EFFICIENT METHODS; HIGH ASPECT RATIOS; HYPERELASTIC MATERIALS; INTERFACIAL STRENGTHS; KEY FACTORS; LARGE-SCALE APPLICATIONS; LINEAR ELASTICS; MATERIAL PROPERTIES; MECHANICAL INTERLOCKING; MICRO-FEATURES; MICRO-PATTERNING; NUMERICAL SIMULATIONS; PRESCRIBED DISPLACEMENTS; ULTRA VIOLETS; UV CURED; UV EMBOSSING; WIDTH RATIOS;

ASPECT RATIO;

EID: 58849141352     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-008-0760-7     Document Type: Article

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