Modeling of large area hot embossing

Microsystem Technologies

Volumn 14, Issue 7, 2008, Pages 1061-1066

  Worgull, M ^a   Kabanemi, K K ^b   Marcotte, J P ^b   Hetu J F ^b   Heckele, M ^a  

^a KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

^b NATIONAL RESEARCH COUNCIL CANADA   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

MATHEMATICAL MODELS; MICROSTRUCTURE; PLASTIC MOLDS; PROJECT MANAGEMENT;

LARGE AREA HOT EMBOSSING; MICROENGINEERING;

INJECTION MOLDING;

EID: 44249102728     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-007-0493-z     Document Type: Conference Paper

References (17)

1. Benzler T, Piotter V, Hanemann T, Mueller K, Norajitra P, Ruprecht R, Hausselt J (1999) Innovations in molding technologies for microfabrication SPIE conference on micromachining and microfabrication process technology v, Santa clara, California, September 1999
2. Gale MT, Kane J, Knop K (1978) ZOD images: embossable surface-relief structures for color and black-and-white reproduction. J Appl Photogr Eng 4:41
3. Hanemann T, Heckele M, Piotter V (2000) Current status of micromolding technology. Polymer News 25:224-229
4. Heckele M, Bacher W, Hanemann T, Ulrich H (1997) Hot embossing and injection molding for microoptical components. SPIE Conference, San Diego
5. Heckele M, Schomburg WK (2004) Review on micro molding of thermoplastic polymers. J Micromech Microeng 14:R1-R14
6. Juang Y, Lee LJ, Koelling KW (2002a) Hot embossing in microfabrication. Part 1: experimental. Polymer Eng Sci 42(3):539-550
7. Juang Y, Lee LJ, Koelling KW (2002b) Hot embossing in microfabrication. Part 2: rheological characterization and process analysis. Polymer Eng Sci 42(3):551-556
8. Kabanemi KK, Crochet MJ (1992) Thermoviscoelastic calculation of residual stresses and residual shapes of injection molded parts. Int Polym Process 1:60
9. Karypis G, Kumar V (1997) A coarse-grain parallel formulation of multilevel k-way graph partitioning algorithm. In: 8th SIAM conference on parallel processing for scientific computing
10. Michel A, Ruprecht R, Harmening M, Bacher W (1993) "Abformung von Mikrostrukturen auf prozessierten Wafern" KfK Bericht 5171. Dissertation, Universität Karlsruhe, Institut für Mikrostrukturtechnik
11. Narayanaswamy OS (1971) A model of structural relaxation in glassæ. J Am Ceram Soc 54:491
12. Saad Y (2003) Iterative methods for sparse linear systems, 2nd edn, SIAM, p 528
13. Truckenmüller R (2002) Herstellung dreidimensionaler Mikrostrukturen aus Polymermembranen. Dissertation, Universität Karlsruhe, Institut für Mikrostrukturtechnik
14. Worgull M, Heckele M (2004) New aspects of simulation in hot embossing. Microsystem Technol 10:432-437
15. Worgull M, Heckele M, Schomburg W (2004) Large scale hot embossing, DTIP conference 2004, Montreux
16. Worgull M, Heckele M, Schomburg WK (2003) Analysis of the micro hot embossing process, Forschungszentrum Karlsruhe, FZKA-Bericht 6922
17. Worgull M, Hetu J-F, Kabanemi KK, Heckele M (2006) Modeling and optimization of the hot embossing process for micro- and nanocomponent fabrication. Microsystem Technol 12(10-11):947-952