GlassPack - A 3D glass based interposer concept for sip with integrated optical interconnects

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 1647-1652

  Schroder H ^a   Brusberg, L ^a   Erxleben, R ^a   Ndip, I ^a   Topper M ^a   Nissen, N F ^a   Reichl, H ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL INTERCONNECTS; HIGH FREQUENCY; INTEGRATED OPTICAL INTERCONNECTS; INTEGRATION CAPABILITY; INTEGRATION SCHEME; LASER DRILLING; MODELING RESULTS; OPTICAL INTEGRATION; PCB INTEGRATION; PROMISING MATERIALS; THIN GLASS; THIN-FILM DEPOSITIONS; THROUGH-VIAS;

DEPOSITION; INTEGRATED OPTICS; ION EXCHANGE; OPTICAL INTERCONNECTS; POLYCHLORINATED BIPHENYLS; WAVEGUIDES;

GLASS;

EID: 77955221758     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490760     Document Type: Conference Paper

References (17)

1. www.itrs.net
2. Sakai, J. et al., Proc. of ECOC, Brussels, 21-25 September 2008, Belgium
3. Lukowicz, P., Jahns, J, Barbieri, R., Benabes, P., Bierhoff, T., Gauthier, A., Jarczynski, M., Russell, G. A., Schrage, J., Süllau, W., Snowdon, J.F., Wirz, M., Tröster, G., Optoelectronic Interconnection Technology in the HOLMS System, IEEE J. on select. Topiocs in Quantum Electronics., 9, No.2, March/April 2003
4. Nakagawa, S., Kuchta, D.,Schow, C., John, R., Coldren, L. A., Chang, Y.-C., "1.5mW/Gbps low power optical interconnect transmitter exploiting high-efficience VCSEL and CMOS driver," Tech. Dig. Optical Fiber Communication Conf., San Diego, CA, February 2008.
5. Brusberg, L., Schröder, H., Töpper, M., Arndt-Staufenbiel, N., Röder, J., Lutz, M., Reichl, H.,"Thin Glass Based Packaging Technologies for Optoelectronic Modules", Proc. 59th Electronic Components and Technology Conference, San Diego, California, USA (2009), pp. 207-212
6. Brusberg, L., Schröder, H., Erxleben, R., Ndip, I., Töpper, M., Nissen, N.F., Reichl, H., "Glass Carrier Based Packaging Approach Demonstrated on a Parallel Optoelectronic Transceiver Module for PCB Assembling ", Proc. 60th Electronic Components and Technology Conference, Las Vegas, NY, USA (2010), accepted
7. Erxleben, R., Ndip, I., Brusberg, L., Schröder, H., Töpper, M., Scheel, W., Guttowski, S., Reichl, H., "A comparative study of microstrip, stripline and coplanar lines on different substrate technologies for high performance applications", 42nd International Symposium on Microelectronics (IMAPS 2009), Nov. 1-5, 2009, San Jose, CA, USA.
8. Brusberg, L., Schröder, H., Arndt-Staufenbiel, N., Wiemer, M.,"GlassPack": a novel photonic packaging and integration technology using thin glass foils", Proc. Photonics Europe 2008, Strasbourg, France, 7-11 April 2008
9. Brusberg, L., Schröder, H., Erxleben, R., Ndip, I., Töpper, M., Nissen, N., Reichl, H., "Glass Carrier Based Packaging Approach Demonstrated on a Parallel Optoelectronic Transceiver Module for PCB Assembling", Proc. 60th Electronic Components and Technology Conference, Las Vegas, NY, USA (2010), accepted
10. Töpper, M., Brusberg, L., Schröder, H., Erxleben, R., Ndip, I., Reichl, H., Yamamoto, H., Todt, G., "3-D Thinfilm Interposer based on TGV (Through Glass Vias): An Alternative to Si-Interposer", Proc. 60th Electronic Components and Technology Conference, Las Vegas, NY, USA (2010), accepted
11. Seki, M. et al "Two-step purely thermal ion-exchange technique for single-mode waveguide devices in glass" Electronics Letters, Vol.24, No.20 (1988), pp.1258-1289.
12. Ramaswamy, R. V. "Planar buried ion-exchanged glass waveguides: difffusion characteristics" Journal of Quantum Electronics, Vol.QE-22, No.6 (1986), pp.883-892.
13. Ramaswamy, R. V. et al "Ion-exchanged glass waveguides: a review", Journal of Lightwave Technology, Vol.6, No.6 (1988), pp. 984-1004.
14. Najafi, S. I. "Introduction to glass integrated optics" Artech House (Boston, London 1992).
15. Arndt-Staufenbiel et al "Specific glass fiber technologies: lensing and laser fusion," Proc. of SPIE, Vol.5445 (2004).
16. Schröder, H. "Optical coupling using thin glass based arrayed waveguide components" Proc. of 14th Microoptics Conference, Brussels, 25-27 September (2008), pp. 56-57.
17. Schröder, H. et al "Out-of-plane coupling using thin glass based arrayed waveguide components" Proc. of SPIE, Vol.7221 (2009).