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Volumn , Issue , 2007, Pages 393-396

Deep wet etching-through 1mm Pyrex glass wafer for microfluidic applications

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS SILICON; COMPOSITE MICROMECHANICS; ETCHING; GLASS; MECHANICAL ENGINEERING; MECHANICS; MECHATRONICS; MEMS; MICROELECTROMECHANICAL DEVICES; NANOFLUIDICS; NONMETALS; PHOTORESISTS; REACTIVE ION ETCHING; SILICON; SILICON WAFERS; STRESSES;

EID: 52249115140     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (18)

References (14)
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    • Li, X.1    Abe, T.2    Esashi, M.3
  • 4
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    • A new masking technology for deep glass etching and its microfluidic application
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  • 5
    • 15544373657 scopus 로고    scopus 로고
    • Characterization of masking layers for deep wet etching of glass in an improved HF/HCl solution
    • C. Iliescu, J. Jing, F.E.H. Tay, J.M. Miao, T. Sun, Characterization of masking layers for deep wet etching of glass in an improved HF/HCl solution, Surface Coatings Tech., 198(1-3), 2005, pp. 314-318.
    • (2005) Surface Coatings Tech , vol.198 , Issue.1-3 , pp. 314-318
    • Iliescu, C.1    Jing, J.2    Tay, F.E.H.3    Miao, J.M.4    Sun, T.5
  • 6
    • 0032021451 scopus 로고    scopus 로고
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    • Stjernström, M.1    Roeraade, J.2
  • 7
    • 11344282867 scopus 로고    scopus 로고
    • Optimization of PECVD amorphous silicon process for deep wet etching of Pyrex glass
    • C. Iliescu, J.M. Miao, F.E.H. Tay, Optimization of PECVD amorphous silicon process for deep wet etching of Pyrex glass, Surface Coatings Tech., 192(1), 2005, 43-47.
    • (2005) Surface Coatings Tech , vol.192 , Issue.1 , pp. 43-47
    • Iliescu, C.1    Miao, J.M.2    Tay, F.E.H.3
  • 9
    • 0032090541 scopus 로고    scopus 로고
    • Deep wet etching of borosilicate glass using anodically bonded silicon substrate as mask
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  • 10
    • 52249105928 scopus 로고    scopus 로고
    • C. Iliescu, F.E.H. Tay and J.M. Miao, Strategies in deep wet etching of Pyrex glass, Sensors and Actuators A (article in press, 2006).
    • C. Iliescu, F.E.H. Tay and J.M. Miao, Strategies in deep wet etching of Pyrex glass, Sensors and Actuators A (article in press, 2006).
  • 11
    • 69749109847 scopus 로고    scopus 로고
    • Stress control in masking layers for deep wet micromachining of Pyrex glass
    • C. Iliescu, J. Miao, F.E.H. Tay, Stress control in masking layers for deep wet micromachining of Pyrex glass, Sensors and Actuators A, 117/2, (2005) 286-292.
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    • Iliescu, C.1    Miao, J.2    Tay, F.E.H.3
  • 12
    • 33747591631 scopus 로고    scopus 로고
    • Defectfree wet etching through Pyrex glass using Cr/Au mask
    • F.E.H. Tay, C. Iliescu, J. Jing, J.M. Miao, Defectfree wet etching through Pyrex glass using Cr/Au mask, Microsystem Technologies, 12 (10-11), 2006, 935-939.
    • (2006) Microsystem Technologies , vol.12 , Issue.10-11 , pp. 935-939
    • Tay, F.E.H.1    Iliescu, C.2    Jing, J.3    Miao, J.M.4
  • 13
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    • C. Iliescu, D.P. Poenar, M. Carp, F.C. Loe, A microfluidic device for impedance spectroscopy analysis of biological samples, Sensors and Actuators B (article in press, 2006).
  • 14
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    • D.P. Poenar, C. Iliescu, M. Carp, A.J. Pang and K.J. Leck, Glass-based microfluidic device fabricated by Parylene wafer-to-wafer bonding for impedance spectroscopy, Sensors and Actuators A. (article in press, 2006).
    • D.P. Poenar, C. Iliescu, M. Carp, A.J. Pang and K.J. Leck, Glass-based microfluidic device fabricated by Parylene wafer-to-wafer bonding for impedance spectroscopy, Sensors and Actuators A. (article in press, 2006).


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.