Modeling and experimental verification of the contact resistance of a novel anisotropic conductive adhesive

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 5, Issue , 2007, Pages 149-157

  Ramkumar, S Manian ^a   Srihari, Krishnaswami ^b  

^a ROCHESTER INSTITUTE OF TECHNOLOGY   (United States)

^b State University of New York   (United States)

Author keywords

Anisotropic Conductive Adhesive; Contact Resistance; Lead free Assembly; Magnetic Alignment; Modeling

Indexed keywords

ADHESIVES; ANISOTROPY; CHAINS; CONDUCTIVE MATERIALS; CONTACT RESISTANCE; CURING; ELECTRIC CONNECTORS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; MAGNETIC FIELDS; MAGNETISM; MODELS;

ANISOTROPIC CONDUCTIVE ADHESIVES; ELECTRICAL CONNECTION; EXPERIMENTAL VERIFICATION; INTERFACIAL RESISTANCES; LATERAL CONDUCTIVITY; LEAD-BASED MATERIALS; LEAD-FREE ASSEMBLY; MAGNETIC ALIGNMENT;

ADHESIVE JOINTS;

EID: 84928633922     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE200742931     Document Type: Conference Paper

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