Multilayer silicon RF system-in-package technique using magnetically aligned anisotropic conductive adhesive

IEEE MTT-S International Microwave Symposium Digest

Volumn , Issue , 2009, Pages 797-800

  Moon, Sungwook ^a   Khanna, S Kummar ^b   Chappell, William J ^a  

^a PURDUE UNIVERSITY   (United States)

^b Shiva Consulting Inc   (United States)

Author keywords

Anisotropic conductive adhesive; Multi chip stacking; RF packaging; System in package; Vertical interconnects

Indexed keywords

ANISOTROPIC CONDUCTIVE ADHESIVES; ASSEMBLY PROCESS; COST-EFFECTIVE SOLUTIONS; FACE DIRECTION; INTEGRATED SYSTEMS; MULTI-CHIP; MULTILAYER PACKAGE; RF PACKAGING; RF SYSTEM; SILICON SUBSTRATES; SYSTEM IN PACKAGE;

ADHESIVE JOINTS; ANISOTROPY; CHIP SCALE PACKAGES; ELECTRIC POWER SYSTEM INTERCONNECTION; INSULATING MATERIALS; INTEGRATED OPTICS; MICROWAVES; MULTILAYERS; RADIOFREQUENCY SPECTROSCOPY; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS;

PACKAGING;

EID: 77949929231     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MWSYM.2009.5165817     Document Type: Conference Paper

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