Lead free assembly : Conductive adhesives offer a real alternative

Global SMT and Packaging

Volumn 3, Issue 7, 2003, Pages 15-18

  Dreezen, G ^a   Luyckx, G ^a  

^a Emerson and Cuming   (Belgium)

Author keywords

Corrosion; Electrically conductive adhesive; Lead free; Low temperature processing; Non noble metallisations

Indexed keywords

CARRIER SENSE MULTIPLE ACCESS; CERAMIC MATERIALS; ELECTRIC RESISTANCE; ELECTROCHEMICAL CORROSION; INTERFACES (MATERIALS); LEAD ALLOYS; METALLIZING; SOLDERING ALLOYS; THERMAL CYCLING;

CONTACT RESISTANCE; ELECTRICALLY CONDUCTIVE ADHESIVES;

ADHESIVES;

EID: 2942720595     PISSN: 14740893     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

References (9)

1. Lu D., Wong C.P., Tong Q.: IEE Trans.Elec.Pack.Man., July 1999, 2-3, p. 223
2. Gilleo K.: Surface Mount Technology, 1995, 9.1, p. 39-45
3. Gilleo K.: Soldering and Surface Mount Technology, 1995, 19, p. 2-17
4. Tong Q., Markley D., Fredrickson G., Kuder R. and Lu D.: 1999 Electronic Components & Technology Conference, 1999, p. 347-352
5. Dreezen G., Luyckx G., On Board Technology, September 2001, p. 46
6. Dreezen G., Luyckx G., IMAPS 2001 Proc. International Symposium on Microelectronics, 2001, p. 19
7. Dreezen G., Deckx E., Luyckx G., IMAPS 2002, Proc. European Microelectronics Packaging & Interconncetion Symposium, 2002, p. 164
8. Fredrickson G., Cheng C. M., Electronic Components and Technology Conference, 2001
9. Grusd A., Circuits Assembly, August 1999 p.32