Influence of PCB surface finish and thermal and temperature/humidity aging on the performance of a novel anisotropic conductive adhesive for lead-free surface mount assembly

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 65-73

  Ramkumar, S Manian ^a   Srihari, K ^b  

^a ROCHESTER INSTITUTE OF TECHNOLOGY   (United States)

^b State University of New York   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AREA ARRAY PACKAGES; CONDUCTIVE ADHESIVES; LEAD-FREE ASSEMBLY; PRODUCT MINIATURIZATION;

AGING OF MATERIALS; ASSEMBLY; CONTACT RESISTANCE; ELECTRONICS PACKAGING; FINISHING; OPTICAL INTERCONNECTS; SURFACE MOUNT TECHNOLOGY;

PRINTED CIRCUIT BOARDS;

EID: 35348920032     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373778     Document Type: Conference Paper

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