Performance of a novel anisotropic conductive adhesive under thermal and temperature/humidity aging conditions

Proceedings - 2006 International Symposium on Microelectronics, IMAPS 2006

Volumn , Issue , 2006, Pages 92-99

  Manian Ramkumar, S ^a   Srihari, K ^b  

^a ROCHESTER INSTITUTE OF TECHNOLOGY   (United States)

^b State University of New York   (United States)

Author keywords

Lead free assembly; Novel anisotropic conductive adhesive; Temperature humidity aging; Thermal aging

Indexed keywords

ANISOTROPIC CONDUCTIVE ADHESIVES; INSULATION RESISTANCE; LEAD-BASED MATERIALS; LEAD-FREE ASSEMBLY; PACKAGING APPLICATIONS; PERFORMANCE CHARACTERISTICS; PRODUCT MINIATURIZATION; TEMPERATURE-HUMIDITY AGING;

ADHESIVES; CURING; ELECTRONICS PACKAGING; MICROELECTRONICS; THERMAL AGING;

ADHESIVE JOINTS;

EID: 84876531949     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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