A novel anisotropic conductive adhesive for lead-free surface mount electronics packaging

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Volumn 5, Issue , 2005, Pages 381-389

  Manian Ramkumar, S ^a   Srihari, Krishnaswami ^b  

^a ROCHESTER INSTITUTE OF TECHNOLOGY   (United States)

^b State University of New York   (United States)

Author keywords

Anisotropic Conductive Adhesive; Lead free Assembly; Nexaura; Temperature Humidity Aging; Thermal Aging; Z Bond

Indexed keywords

ANISOTROPIC CONDUCTIVE ADHESIVE; LEAD-FREE ASSEMBLY; NEXAURA; TEMPERATURE-HUMIDITY AGING; THERMAL AGING; Z BOND;

ANISOTROPY; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; INTERMETALLICS; MINIATURE INSTRUMENTS; SURFACE MOUNT TECHNOLOGY;

ADHESIVES;

EID: 33645086394     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2005-83021     Document Type: Conference Paper

References (12)

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