Integration of a temporary carrier in a TSV process flow

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 865-871

  Charbonnier, J ^a   Cheramy, S ^a   Henry, D ^a   Astier, A ^a   Brun, J ^a   Sillon, N ^a   Jouve, A ^b   Fowler, S ^b   Privett, M ^b   Puligadda, R ^b   Burggraf, J ^c   Pargfrieder, S ^c  

^a CEA GRENOBLE   (France)

^b BREWER SCIENCE INC   (United States)

^c EV GROUP   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING TECHNIQUES; CLEANING PROCESS; DEVICE ARCHITECTURES; FLOW PROPERTIES; HIGH-TEMPERATURE ADHESIVES; MECHANICAL STRENGTH; PROCESS FLOWS; STACK WAFERS; THERMAL STABILITY; THROUGH SILICON VIAS; ULTRA-THIN; WAFER HANDLING; WAFER LEVEL; WAFER STACKING TECHNOLOGY;

ASPECT RATIO; CHEMICAL CLEANING; CHEMICAL REACTIONS; CHEMICAL RESISTANCE; CHEMICAL STABILITY; DEBONDING; MECHANICAL PROPERTIES; THREE DIMENSIONAL;

WAFER BONDING;

EID: 70349686483     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074114     Document Type: Conference Paper

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