Joint structure in high brightness light emitting diode (HB LED) packages

Materials Science and Engineering: A

Volumn 441, Issue 1-2, 2006, Pages 357-361

  Park, Jin Woo ^a   Yoon, Young Bok ^a   Shin, Sang Hyun ^a   Choi, Sang Hyun ^a  

^a Samsung Electro Mechanics   (South Korea)

Author keywords

Au Sn; HB LED; Package; Thermal resistance

Indexed keywords

ELECTRONICS PACKAGING; HEAT RESISTANCE; HEAT SINKS; INTERMETALLICS; LIGHT EMITTING DIODES; SOLDERING ALLOYS;

HIGH BRIGHTNESS LIGHT EMITTING DIODE; MELTING POINT;

SOLDERED JOINTS;

ELECTRONICS PACKAGING; HEAT RESISTANCE; HEAT SINKS; INTERMETALLICS; LIGHT EMITTING DIODES; SOLDERED JOINTS; SOLDERING ALLOYS;

EID: 33750606280     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.09.043     Document Type: Article

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