Combining DIC techniques and finite element analysis for reliability assessment on micro and nano scale

Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Volumn , Issue , 2003, Pages 450-455

  Vogel, D ^a   Dudek, R ^a   Keller, J ^a   Michel, B ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; NANOTECHNOLOGY; RELIABILITY ANALYSIS; SOLDERING; THREE DIMENSIONAL INTEGRATED CIRCUITS;

APPLICATION EXAMPLES; DEFORMATION MEASUREMENTS; DIGITAL IMAGE CORRELATION METHODS; HIGH-TEMPERATURE ELECTRONICS; LOW CYCLE FATIGUE BEHAVIOR; MICROSYSTEM DEVICES; POLYMER ELECTRONICS; RELIABILITY ASSESSMENTS;

FINITE ELEMENT METHOD;

EID: 79960405384     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1271564     Document Type: Conference Paper

References (13)

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