Micro- and nanomaterials characterization by image correlation methods

Sensors and Actuators, A: Physical

Volumn 99, Issue 1-2, 2002, Pages 165-171

  Vogel, D ^a   Gollhardt, A ^a   Michel, B ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

Correlation; Electronics packaging; Material properties; Mechanical strain

Indexed keywords

CHIP SCALE PACKAGES; CORRELATION METHODS; DEFORMATION; IMAGE ANALYSIS; STRAIN; THERMAL EXPANSION; THERMOMECHANICAL TREATMENT;

IMAGE CORRELATION;

NANOSTRUCTURED MATERIALS;

EID: 0037198099     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(01)00908-6     Document Type: Conference Paper

References (11)