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Volumn 3897, Issue , 1999, Pages 224-238
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Strain measurement in micrometrology
a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
ALGORITHMS;
CORRELATION METHODS;
DEFORMATION;
ELECTRONICS PACKAGING;
FINITE ELEMENT METHOD;
INTEGRATED CIRCUIT MANUFACTURE;
INTERFEROMETRY;
MICROELECTRONICS;
MICROOPTICS;
STRESS ANALYSIS;
THERMAL STRESS;
MICRO MOIRE;
MICROMETROLOGY;
STRAIN MEASUREMENT;
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EID: 0033335451
PISSN: 0277786X
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (10)
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References (20)
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