Studies on parameters for popcorn cracking

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics

Volumn , Issue , 2001, Pages 140-148

  Dudek, Rainer ^a   Walter, Hans ^a   Michel, Bernd ^a   Alpern, Peter ^b   Schmidt, Roland ^b   Tilgner, Rainer ^b  

^a FRAUNHOFER IZM   (Germany)

^b INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CRACKS; DIFFUSION; FRACTURE TOUGHNESS; MOISTURE;

POPCORN CRACKING;

POLYMERS;

EID: 0035790846     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. Kuo, A.Y., Nguyen, L.T, "Hygrothermal Reliability Evaluation of Plastic IC Packages with Computer-Aided Engineering Tools, "Proc. of First IEEE Int. Symp. Polymeric Electronic Packaging, Norrköping, Sweden, October 1997, pp.158-168.
2. T.Y. Lin, A. A. O. Tay, "A J-Integral Criterion for Delamination of Bi-Material Interfaces Incorporating Hygrothermal Stress, "EEP-Vol. 19-2, Advances in Electronic Packaging, Vol. 2, ASME 1997, pp. 1421-1428.
3. R. Dudek, P. Sommer, B. Michel, P. Alpern, Ch. Birzer, R. Tilgner, "Investigations on Popcorn Cracking of T-QFP Packages," Proc. of ECTC 48, Seattle, May 1998, pp. 944-951.
4. R. Schmidt, P. Alpern, K. Plecher and R. Tilgner, "Investigation of the adhesion strength between MC and lead frame at higher temperatures", Proc. IEEE/EPTC, 1998, pp. 349-353.
5. th European Symposium, Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2000), Dresden, Germany, October 2-6, 2000, Microelectronics Reliability 40 (2000), pp. 1503-1508.
6. th European Symposium, Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2000), Dresden, Germany, October 2-6, 2000, Microelectronics Reliability 40 (2000), pp. 1503-1508.
7. P. Alpern, R. Dudek, R. Schmidt, V. Wicher and R. Tilgner, "On the Mode II Popcorn Effect in Thin Packages" submitted to IEEE Trans. CPMT.
8. Y. Murakami (ed.): Stress Intensity Factors Handbook, Pergamon Press, Oxford, New York, 1988.
9. H. Frémont, J.Y Delétage, A. Pintus, Y. Danto, "Evaluation of the Moisture Sensivity of Molding Compounds of IC's Packages", Proc. Workshop on Polymeric Materials for Microelectronics and Photonics Applications (EEP-Vol. 27), Paris, Dec. 1999, pp. 67-70.
10. th IEEE/ECTC, 1998, pp. 1372-1378.