Exposed die-top encapsulation molding for an improved high-performance flip chip BGA package

IEEE Transactions on Advanced Packaging

Volumn 29, Issue 4, 2006, Pages 674-682

  Chong, Desmond Y R ^a   Lim, B K ^a,b   Rebibis, Kenneth J ^d   Pan, S J ^a,c   Sivalingam, K ^a   Kapoor, R ^d   Sun, Anthony Y S ^a   Tan, H B ^a  

^a United Test and Assembly Center Ltd UTAC   (Singapore)

^b MICRON TECHNOLOGY INC   (United States)

^c Indira Gandhi Centre for Atomic Research   (India)

^d Avago Technologies ^*

Author keywords

Flip chip ball grid array (BGA); High performance; High pin count; Solder joints reliability; Superior heat dissipation; Thermal dissipation

Indexed keywords

COMPUTER SIMULATION; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; HEAT LOSSES; SOLDERED JOINTS;

FLIP CHIP BALL GRID ARRAY (BGA) PACKAGE; SOLDER JOINTS RELIABILITY; SUPERIOR HEAT DISSIPATION; THERMAL DISSIPATION;

PACKAGING MATERIALS;

EID: 37849186936     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2006.884776     Document Type: Article

References (9)

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