Reliability assessment of a high performance flip-chip BGA package (organic substrate based) using finite element analysis

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 207-213

  Chong, Desmond Y R ^a   Kapoor, R ^a   Sun, Anthony Y S ^a  

^a UTAC   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; RELIABILITY; SOLDERED JOINTS; STRESSES; SURFACE MOUNT TECHNOLOGY; THERMAL EFFECTS; VISCOPLASTICITY;

BALL GRID ARRAY; DARVEAUXS COMPUTATION; HIGH END COMPUTERS; VISCOPLASTIC STRAIN ENERGY;

FLIP CHIP DEVICES;

EID: 0038351012     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)

1. H. Matsushima, S. Baba, Y. Tomita, M. Watanabe, E. Hayashi, Y. Takemoto, "Thermal Enhanced Flip-chip BGA with Organic Substrate", Proceedings of the 48th ECTC, 1998.
2. L. Zhang, S.S. Chee, A. Maheshwari, "Effect of Solder Ball Pad Design on Cavity Down BGA Solder Joint Reliability", Proceedings of the 52nd ECTC, pp. 1001-1006, 2002.
3. S. Y. Teng, M. Brillhart, "Reliability Assessment of a High CTE CBGA for High Availability System", Proceedings of the 52nd ECTC, pp. 611-616, 2002.
4. R. Darveaux, K. Banerji, A. Mawer, G. Dody, "Reliability of Plastic Ball Grid Array Assembly", Chapter 13 in "Ball Grid Array Technology", Edited by J.H. Lau, McGraw-Hill Inc., New York, 1995.
5. R. Darveaux, "Effect of Simulation Methodology on Solder Joint Crack Growth Correlation", Proceedings of the 50th ECTC, pp. 1048-1058, 2000.
6. X.Q. Shi, H.L.J. Pang, W. Zhou, Z.P. Wang, "A Modified Energy-Based Low Cycle Fatigue Model for Eutectic Solder Alloy", Scripta Materialia, Vol. 41, No. 3, pp. 289-296, 1999.
7. H.L.J. Pang, Y.R. Chong, "FEA Modeling of FCOB Assembly Solder Joint Reliability", Micro Mat 2000, 3rd International Conference and Exhibition, Germany, 17th to 19th April 2000.
8. John H.L. Pang, D.Y.R. Chong, T.H. Low, "Thermal Shock Versus Thermal Cycling Simulations For Flip Chip Solder Joint Reliability Assessment", APACK 2001, 5th to 7th Dec 2001, Singapore International Convention & Exhibition Centre.
9. M. Shiratori, Q. Yu, S.B. Wang, "A Computational and Experimental Hybrid Approach to Creep-Fatigue Behavior of Surface-Mounted Solder Joints", Advances in Electronic Packaging, EEP-Vol. 10-1, ASME 1995.
10. A.R. Syed, "Factors Affecting Creep-Fatigue Interaction in Eutectic Sn/Pb Solder Joints", Advances in Electronic Packaging, EEP-Vol. 19-2, Vol. 2, ASME 1997.
11. X.Q. Shi, W. Zhou, H.L.J. Pang, Z.P. Wang, Y.P. Wang, "Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy", Journal of Electronic Packaging, Transactions of the ASME, Vol.121, pp. 179-185, September 1999.
12. J.D. Morrow, ASTM STP 378, pp.45, ASTM, Philadelphia, 1964.
13. X.Q. Shi, Z.P. Wang, W. Zhou, H.L.J. Pang, Q.J. Yang, "A New Creep Constitutive Model for Eutectic Solder Alloy", Journal of Electronic Packaging, Transactions of the ASME, Vol.124, pp. 85-90, June 2002.
14. S.C. Hung, P.J. Zheng, H.N. Chen, S.C. Lee, J.J. Lee, "Board Level Reliability of Chip Scale Packages", International Journal of Microcircuits and Electronic Packaging, Vol. 23, No. 1, First Quarter 2000.
15. R.K. Agarwal, L. Tuchscherer, H. Cui, R. Jain, T. Torri, S. Baxter, "Thermal Cycling and Thermal Shock for FCOB Testing", EEP-Vol. 26-2, Advances in Electronic Packaging, Vol. 2, ASME 1999.
16. A. Yeo, C. Lee, John H.L. Pang, "Flip Chip Solder Joint Fatigue Life Model Investigation", 4th Electronics Packaging Technology Conference, Singapore, Dec 2002.