Advanced direct-polish process on organic non-porous ultra low-k fluorocarbon dielectric on Cu interconnects

ECS Transactions

Volumn 34, Issue 1, 2011, Pages 653-658

  Gu, Xun ^a   Nemoto, Takenao ^a   Tomita, Yugo ^a   Mateo, Ricardo Duyos ^a   Teramoto, Akinobu ^a   Kuroki, Shin Ichiro ^a   Sugawa, Shigetoshi ^a   Ohmi, Tadahiro ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL EFFECT; CU-INTERCONNECTS; DAMASCENE INTERCONNECTS; EFFECTIVE DIELECTRIC CONSTANTS; ELECTRICAL CHARACTERISTIC; ETCH-STOP LAYERS; MECHANICAL EFFECTS; PROCESS CONDITION; SURFACE PLASMA TREATMENT; ULTRA LOW-K; ULTRA LOW-K DIELECTRICS;

ELECTRIC PROPERTIES; MECHANICAL PROPERTIES; PLASMA APPLICATIONS; SEMICONDUCTOR DEVICE MANUFACTURE; SURFACE TREATMENT;

DIELECTRIC MATERIALS;

EID: 79959632297     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.3567653     Document Type: Conference Paper

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