Reduction of scratch on brush scrubbing in post CMP cleaning by analyzing contact kinetics on ultra low-k dielectric

ECS Transactions

Volumn 19, Issue 7, 2009, Pages 103-109

  Gu, Xun ^a   Nemoto, Takenao ^a   Teramoto, Akinobu ^a   Ito, Takashi ^a   Sugawa, Shigetoshi ^a   Ohmi, Tadahiro ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; CLEANING; DIELECTRIC MATERIALS; EFFICIENCY; FLOW OF FLUIDS; SHEAR FLOW;

COMPATIBLE PROCESS; CONTACT CHARACTERISTICS; FLUOROCARBON FILMS; INTEGRATED CIRCUIT FABRICATION; LOW DOWN PRESSURES; PARTICLE REMOVAL EFFICIENCY; SCRATCH REDUCTION; ULTRA LOW-K DIELECTRICS;

LOW-K DIELECTRIC;

EID: 79955641541     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.3123779     Document Type: Conference Paper

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