Damage-free post-CMP cleaning solution for low-k fluorocarbon on advanced interconnects

Solid State Phenomena

Volumn 145-146, Issue , 2009, Pages 381-384

  Gu, Xun ^a   Nemoto, Takenao ^a   Teramoto, Akinobu ^a   Hasebe, Rui ^a   Ito, Takashi ^a   Ohmi, Tadahiro ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

Damage free; Dielectric constant; Fluorocarbon; Post CMP cleaning solution; XPS

Indexed keywords

DIELECTRIC MATERIALS; ELECTRIC PROPERTIES; LSI CIRCUITS; PERMITTIVITY; X RAY PHOTOELECTRON SPECTROSCOPY;

DAMAGE-FREE; DIELECTRIC CONSTANT; DIELECTRIC CONSTANTS; POST-CMP CLEANING; XPS;

NANOTECHNOLOGY;

EID: 75849151161     PISSN: 10120394     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/SSP.145-146.381     Document Type: Conference Paper

References (3)

1. th Symposium on Plasma Science for materials, P2, (2005)
2. T.Nemoto, Horoshi Imai, Akinobu Teramoto, Takeshi Ito, Shigetoshi Sugawa and Tadahiro Ohmi, J Electro. Chem. Soci., 323, 155(5), (2008)
3. T.Ohmi, M.Hirayama and A.Teramoto, J.Phys. Appl. Phys. D, 43, 39(1), (2006)