End-point detection of Ta/TaN chemical mechanical planarization via forces analysis

Japanese Journal of Applied Physics

Volumn 49, Issue 5 PART 3, 2010, Pages

  Sampurno, Yasa ^a,b   Xun, Gu ^c   Nemoto, Takenao ^c   Zhuang, Yun ^a,b   Teramoto, Akinobu ^c   Philipossian, Ara ^a,b   Ohmi, Tadahiro ^c  

^a UNIVERSITY OF ARIZONA   (United States)

^b Araca Inc   (United States)

^c TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AMPLITUDE DISTRIBUTIONS; CHEMICAL MECHANICAL PLANARIZATIONS; COEFFICIENT OF FRICTIONS; DOWN FORCE; END POINT DETECTION; FAST FOURIER TRANSFORMATIONS; FORCE DATA; FREQUENCY DOMAINS; INTER-LAYER DIELECTRICS; PATTERNED WAFERS; POLISHING TIME; SHEAR FORCE; SPECTRAL FINGERPRINTING; SPECTRAL FINGERPRINTS; TANTALUM NITRIDES; TIME DOMAIN; TRIBOMETERS;

CHEMICAL DETECTION; CHEMICAL MECHANICAL POLISHING; FOURIER ANALYSIS; FRICTION; METADATA; NITRIDES; POLISHING; TANTALUM; TANTALUM COMPOUNDS; TIME DOMAIN ANALYSIS;

CHEMICAL POLISHING;

EID: 77953144334     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.49.05FC01     Document Type: Article

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