Novel end-point detection method by monitoring shear force oscillation frequency for barrier metal polishing in advanced LSI

Materials Research Society Symposium Proceedings

Volumn 1157, Issue , 2010, Pages 157-162

  Gu, Xun ^a   Nemoto, Takenao ^a   Sampurno, Yasa ^b,c   Cheng, Jiang ^b   Theng, Sian Nie ^b,c   Philipossian, Ara ^b,c   Zhuang, Yun ^b,c   Teramoto, Akinobu ^a   Ito, Takashi ^a   Sugawa, Shigetoshi ^a   Ohmi, Tadahiro ^a  

^a TOHOKU UNIVERSITY   (Japan)

^b UNIVERSITY OF ARIZONA   (United States)

^c Araca Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADVANCED LSI; BARRIER FILMS; BARRIER METALS; CMP PROCESS; COPPER DAMASCENE STRUCTURES; END POINT DETECTION; END-POINT DETECTION METHODS; FAST FOURIER TRANSFORMATIONS; FREQUENCY DOMAINS; OSCILLATION FREQUENCY; POLISHED SUBSTRATES; ROTATIONAL RATES; SHEAR FORCE; SILICON DIOXIDE FILM; SPECTRAL AMPLITUDE; SPECTRAL FREQUENCY; TIME DOMAIN; WAFER CARRIER;

CHEMICAL MECHANICAL POLISHING; FOURIER ANALYSIS; METADATA; POINT CONTACTS; POLISHING; SILICA; SILICON WAFERS; SUBSTRATES;

TIME DOMAIN ANALYSIS;

EID: 77953964855     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. P. B. Zantye, A. K. Sikder, N. Gulati, and Ashok Kumar, Proceedings of CMP-MIC Conference (2003).
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3. Y. Sampurno, X. Gu, T. Nemoto, Y. Zhuang, A. Teramoto, T. Ohmi, and A. Philipossian, Proceedings of International Conference on Planarization/CMP Technology, p 132 (2008).
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5. Y. Li, Microelectronic Applications of Chemical Mechanical Planarization, p 82, Wiley Interscience (2007).
6. Y. Sampurno, F. Sudargho, Y. Zhuang, M. Goldstein and A. Philipossian, Thin Solid Films, 516, 7667-7674(2008).