Influence of adhesion of silica and ceria abrasive nanoparticles on Chemical-Mechanical Planarization of silica surfaces

Applied Surface Science

Volumn 257, Issue 20, 2011, Pages 8518-8524

  Volkov, D O ^a   Dandu, P R Veera ^b   Goodman, H ^c   Santora, B ^c   Sokolov, I ^a  

^a CLARKSON UNIVERSITY   (United States)

^b Clarkson University   (United States)

^c Ferro Electronic Material Systems   (United States)

Author keywords

Adhesion; Atomic Force microscopy (AFM); Ceria nanoparticles; Chemical Mechanical Planarization (CMP); Defectivity; Micro scratches; Removal rate; Silica nanoparticles

Indexed keywords

ABRASIVES; ADHESION; ATOMIC FORCE MICROSCOPY; CERIUM OXIDE; CHEMICAL MECHANICAL POLISHING; SEMICONDUCTOR DEVICE MANUFACTURE;

ABRASIVE PARTICLES; CERIA NANOPARTICLES; DEFECTIVITY; DIRECT MEASUREMENT; MAIN PARAMETERS; MICROSCRATCHES; REMOVAL RATE; SEMICONDUCTOR INDUSTRY;

SILICA NANOPARTICLES;

EID: 79959371345     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2011.04.142     Document Type: Article

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