Chemical mechanical polishing of methyl silsesquioxane

Journal of the Electrochemical Society

Volumn 156, Issue 6, 2009, Pages

  Meled, V ^a   Babu, S V ^a   Matijevic E ^a  

^a CLARKSON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVE PARTICLES; CERIA PARTICLES; ELECTROSTATIC ATTRACTIONS; METAL OXIDES; METHYL SILSESQUIOXANE; METHYL SILSESQUIOXANES; MSQ FILMS; NANO SIZES; PACKED COLUMN TECHNIQUES; PLANARIZATION; POLISH RATES;

ABRASIVES; ALUMINA; CERIUM COMPOUNDS; CHEMICAL MECHANICAL POLISHING; CHEMICAL POLISHING; DIELECTRIC MATERIALS; ORGANIC COATINGS; SILICA;

POLYMER FILMS;

EID: 65449141283     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3111027     Document Type: Article

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