Particle adhesion studies relevant to chemical mechanical polishing

Langmuir

Volumn 21, Issue 22, 2005, Pages 9866-9872

  Lu, Zhenyu ^a,b   Ryde, Niels P ^a,c   Babu, S V ^a   Matijević, Egon ^a  

^a CLARKSON UNIVERSITY   (United States)

^b MICRON TECHNOLOGY INC   (United States)

^c NanoSystems   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GLASS BEADS; PACKED COLUMN TECHNIQUE; PARTICLE ADHESION; POLISH RATES;

ABRASIVES; ALUMINA; CHEMICAL MECHANICAL POLISHING; COMPUTER SIMULATION; COPPER; DEPOSITION; GLASS; SILICA; SLURRIES; SUBSTRATES;

ADHESION;

EID: 27544470482     PISSN: 07437463     EISSN: None     Source Type: Journal    
DOI: 10.1021/la058006v     Document Type: Article

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