Removal of shallow and deep scratches and pits from polished copper films

Electrochemical and Solid-State Letters

Volumn 6, Issue 10, 2003, Pages

  Hegde, Sharath ^a   Babu, S V ^a  

^a Clarkson University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AGENTS; CHEMICAL MECHANICAL POLISHING; HYDROGEN PEROXIDE; PH; SILICA; SOLUTIONS;

BENZOTRIAZOLE; COLLOIDAL SILICA; COMPLEXING AGENT; DEEP SCRATCHES; PITS; PLANARIZATION; SHALLOW SCRATCHES;

COPPER;

EID: 1842854744     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1602333     Document Type: Article

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