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Volumn 65, Issue 4, 2011, Pages 277-280

Electromigration stress induced deformation mechanisms in free-standing platinum thin films

Author keywords

Electromigration; Grain growth; Nanocrystalline microstructure; Transmission electron microscopy

Indexed keywords

DEFORMATION MECHANISM; EXPERIMENTAL EVIDENCE; GRAIN ROTATION; GRAIN SIZE; GRAIN-BOUNDARY MOBILITY; NANOCRYSTALLINE MICROSTRUCTURES; NEAR ROOM TEMPERATURE; PLATINUM FILMS; PLATINUM THIN FILM; STRESS-INDUCED DEFORMATION; TRANSMISSION ELECTRON;

EID: 79958239561     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2011.04.030     Document Type: Article
Times cited : (18)

References (15)
  • 7
    • 85072869527 scopus 로고    scopus 로고
    • Fundamentals of Electromigration
    • Springer Verlag Berlin
    • K.-N. Tu Fundamentals of Electromigration Solder Joint Technology 2007 Springer Verlag Berlin 211 243
    • (2007) Solder Joint Technology , pp. 211-243
    • Tu, K.-N.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.