Electromigration-induced stress interaction between vias and polygranular clusters

Scripta Materialia

Volumn 44, Issue 10, 2001, Pages 2497-2501

  Park, Young Joon ^a   Joo, Young Chang ^b  

^a Korea Institute of Science and Technology   (South Korea)

^b Seoul National University   (South Korea)

Author keywords

Aluminum; Computer simulation; Electromigration; Interconnects

Indexed keywords

ALUMINUM; COMPUTER SIMULATION; CURRENT DENSITY; DIFFUSION IN SOLIDS; STRESS ANALYSIS;

INTERCONNECTS; POLYGRANULAR CLUSTERS; STRESS INTERACTION; VIAS;

ELECTROMIGRATION;

EID: 0035946870     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(01)00674-1     Document Type: Article

References (13)