Integrated SMD pressure/flow/temperature multisensor for compressed air in LTCC technology: Thermal flow and temperature sensing

Microelectronics Reliability

Volumn 51, Issue 7, 2011, Pages 1245-1249

  Maeder, Thomas ^a   Fournier, Yannick ^a   Coma, Jean Bastien ^a   Craquelin, Nicolas ^a   Ryser, Peter ^a  

^a EPFL   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

CONSTANT TEMPERATURE; FABRICATION YIELD; FLUIDIC CHANNELS; LOW-TEMPERATURE CO-FIRED CERAMICS; LTCC TECHNOLOGY; MULTI SENSOR; STRUCTURATION; TEMPERATURE SENSING; THERMAL FLOWS;

COLD STORAGE; COMPRESSED AIR; PNEUMATICS;

PRESSURE VESSELS;

EID: 79958172295     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2011.03.021     Document Type: Conference Paper

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