A new concept for LTCC-based pressure sensors

International Microelectronics and Packaging Society - 3rd IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2007

Volumn , Issue , 2007, Pages 367-372

  Partsch, Uwe ^a   Arndt, Dietmar ^b   Georgi, Hannes ^b  

^a FRAUNHOFER INSTITUTE FOR CERAMIC TECHNOLOGIES AND SYSTEMS   (Germany)

^b ADZ Nagano Gesellschaft für Sensortechnik MbH ^*  (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC PACKAGE; HIGH TEMPERATURE; LINEAR STRESS; LTCC (LOW TEMPERATURE CO-FIRED CERAMIC); MECHANICAL STRUCTURES; MOBILE COMMUNICATIONS;

MEDICAL APPLICATIONS; MICROELECTRONICS; MICROSYSTEMS; PRESSURE SENSORS;

CERAMIC MATERIALS;

EID: 70449919160     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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