3D structuration of LTCC / thick-film sensors and fluidic devices

International Microelectronics and Packaging Society - 3rd IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2007

Volumn , Issue , 2007, Pages 344-350

  Maeder, Thomas ^a   Fournier, Yannick ^a   Wiedmer, Simon ^a   Birol, Hansu ^a   Jacq, Caroline ^a   Ryser, Peter ^a  

^a EPFL   (Switzerland)

Author keywords

3D structuration; LTCC; Processing; Sacrificial layers; Sensors; Thick film

Indexed keywords

LTCC; LTCC (LOW TEMPERATURE CO-FIRED CERAMIC); PACKAGING APPLICATIONS; PROCESSING CONDITION; SACRIFICIAL LAYER; SACRIFICIAL MATERIAL; SENSOR TECHNOLOGIES; STRUCTURATION;

CERAMIC MATERIALS; MICROELECTRONICS; MICROSYSTEMS; PROCESSING; TECHNOLOGY; THICK FILMS; THREE DIMENSIONAL COMPUTER GRAPHICS;

SENSORS;

EID: 84878250027     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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