Integrated LTCC pressure/flow/temperature multisensor for compressed air diagnostics

Sensors

Volumn 10, Issue 12, 2010, Pages 11156-11173

  Fournier, Yannick ^a   Maeder, Thomas ^a   Boutinard Rouelle, Grégoire ^a   Barras, Aurélie ^a   Craquelin, Nicolas ^a   Ryser, Peter ^a  

^a EPFL   (Switzerland)

Author keywords

Flow; Integrated multisensor; LTCC; Pressure; SMD mounting; Temperature

Indexed keywords

ELECTRONIC COMPONENT; ELECTRONICS DESIGN; FLOW; LOW TEMPERATURE CO FIRED CERAMIC(LTCC); LTCC; MULTI SENSOR; PERFORMANCE ASPECTS; SURFACE MOUNT DEVICE;

COMPRESSED AIR; PRESSURE; PRESSURE VESSELS; TEMPERATURE;

CERAMIC PRODUCTS;

DIAGNOSTIC AGENT;

ARTICLE; BIOLOGICAL MODEL; CERAMICS; CHEMISTRY; COLD; COMPRESSED AIR; ELECTRONICS; EQUIPMENT DESIGN; EVALUATION; GENETIC PROCEDURES; HUMAN; HYDRODYNAMICS; INSTRUMENTATION; METHODOLOGY; MICROFLUIDIC ANALYSIS; PRESSURE; SIGNAL PROCESSING; TEMPERATURE;

BIOSENSING TECHNIQUES; CERAMICS; COLD TEMPERATURE; COMPRESSED AIR; ELECTRONICS; EQUIPMENT DESIGN; HUMANS; HYDRODYNAMICS; MICROFLUIDIC ANALYTICAL TECHNIQUES; MODELS, BIOLOGICAL; PRESSURE; SIGNAL PROCESSING, COMPUTER-ASSISTED; TEMPERATURE;

EID: 78650264650     PISSN: 14248220     EISSN: None     Source Type: Journal    
DOI: 10.3390/s101211156     Document Type: Article

References (27)

1. Fournier, Y.; Boutinard Rouelle, G.; Craquelin, N.; Maeder, T.; Ryser, P. SMD pressure and flow sensor for compressed air in LTCC technology with integrated electronics. In Proceedings of Eurosensors XXIII, Lausanne, Switzerland, 2009; pp. 1471-1474.
2. Gongora-Rubio, M.R.; Espinoza-Vallejos, P.; Sola-Laguna, L.; Santiago-Aviles, J.J. Overview of low temperature co-fired ceramics tape technology for meso-system technology (MsST). Sens. Actuat. A-Phys. 2001, 89, 222-241.
3. Peterson, K.A.; Patel, K.D.; Ho, C.K.; Rohde, S.B.; Nordquist, C.D.; Walker, C.A.; Wroblewski, B.D.; Okandan, M. Novel microsystem applications with new techniques in low-temperature cofired ceramics. Int. J. Appl. Ceram. Tec. 2005, 2, 345-363.
4. Hrovat, M.; Belavič, D.; Uršič, H.; Kita, J.; Holc, J.; Drnovšek, S.; Cilenšek, J.; Zarnik, M.S.; Kosec, M. Thick-film pressure/force sensors on different LTCC substrates; a characterization and evaluation. In Proceedings of the 5th IMAPS/ACerS Int'l Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Denver, CO, USA, 2009; paper WA13.
5. Moos, R.; Kita, J. Ceramic multilayer gas sensors--an overview. In Proceedings of the XXXI International Conference of IMAPS Poland Chapter, Krasiczyn, Poland, 2007; pp. 75-82.
6. Moll, A.J. Microsystems and microfluidics: why not LTCC? In Proceedings of the 3rd Int'l Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Denver, CO, USA, 2007; paper KN2.
7. Partsch U.; Gebhardt, S.; Arndt, D.; Georgi, H.; Neubert, H.; Fleischer, D.; Gruchow M. LTCC-Based Sensors for Mechanical Quantities. In Proceedings of the 16th IMAPS European Microelectronics and Packaging Conference (EMPC), Oulu, Finland, 2007; pp. 381-388.
8. Jacq, C.; Maeder, T.; Ryser, P. Sensors and packages based on LTCC and thick-film technology for severe conditions. Sadhana Acad. Proc. Eng. Sci. 2009, 34, 677-687.
9. Golonka, L.J. LTCC microreactors. In Proceedings of the XXX International Conference of IMAPS Poland Chapter, Krakow, Poland, 2006; pp. 57-62.
10. Maeder, T.; Fournier, Y.; Wiedmer, S.; Birol, H.; Jacq, C.; Ryser, P. 3D structuration of LTCC/thick-film sensors and fluidic devices. In Proceedings of the 3rd Int'l Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Denver, CO, USA, 2007; paper THA13.
11. Drüe, K.J.; Hintz, M.; Müller, J.; Perrone, R.; Rentsch, S. Standard- and non-standard applications of LTCC-developments and progresses. In Proceedings of the XXXI International Conference of IMAPS Poland Chapter, Krasiczyn, Poland, 2007; pp. 69-74.
12. Zimmerman, D.W.; Fairchild, M.R.; Brunner, K.W.; Berlin, C.W. Utilizing an LTCC substrate in an under-hood engine control application. In Proceedings of the Conference on Ceramic Interconnect Technology: The Next Generation II, Denver, CO, USA, 2004; paper TA22.
13. Nishigaki, S.; Goebel, U.; Roethlingshoefer, W. LTCC (LFC) material systems and its application in automotive ECU's. In Proceedings of the Conference on Ceramic Interconnect Technology: The Next Generation II, Denver, CO, USA, 2004; paper WP32.
14. Chowdhry, U.; Sleight, A.W. Ceramic substrates for microelectronic packaging. Ann. Rev. Mat. Sci. 1987, 17, 323-340.
15. Tummala, R.R. Ceramics in microelectronic packaging. Am. Ceram. Soc. Bull. 1988, 67, 752-758.
16. Annas, S. Advances in low temperature co-fired ceramic (LTCC) for ever increasing microelectronic applications. In Proceedings of the IEEE Electronic Components and Technology Conference, New Orleans, LA, USA, 2003; pp. 1691-1693.
17. Kita, J.; Rettig, F.; Moos, R.; Drüe, K.-H.; Thust, H. Hot-Plate Gas Sensors - are Ceramics Better? In Proceedings of the 1st Int'l Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Baltimore, MD, USA, 2005; paper WP13.
18. Gongora-Rubio, M.; Solá-Laguna, L.; Moffett, P.J.; Santiago-Avilés, J.J. The utilization of low temperature co-fired ceramics (LTCC-ML) technology for meso-scale EMS, a simple thermistor based flow sensor. Sens. Actuat. 1999, 73, 215-221.
19. Partsch, U.; Arndt, D.; Georgi, H. A new concept for LTCC-based pressure sensors. In Proceedings of the 3rd Int'l Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Denver, CO, USA, 2007; paper THA23.
20. Birol, H.; Maeder, T.; Nadzeyka, I.; Boers, M.; Ryser, P. Fabrication of a Millinewton Force Sensor Using Low Temperature Co-fired Ceramic (LTCC) Technology. Sens. Actuat. A: Phys. 2007, 134, 334-338.
21. Craquelin, N.; Maeder, T.; Fournier, Y.; Ryser, P. Low-cost LTCC-based sensors for low force ranges. In Proceedings of Eurosensors XXIII, Lausanne, Switzerland, 2009; pp. 899-902.
22. Mengeaud, V.; Bagel, O.; Ferrigno, R.; Girault, H.H.; Haider, A.A ceramic electrochemical microreactor for the methoxylation of methyl-2-furoate with direct mass spectrometry coupling. Lab On A Chip 2002, 2, 39.
23. Fournier, Y.; Willigens, R.; Maeder, T.; Ryser, P. Integrated LTCC micro-fluidic modules--an SMT flow sensor. In Proceedings of the 15th IMAPS European Microelectronics and Packaging Conference (EMPC), Bruges, Belgium, 2005; paper P2.06, pp. 577-581.
24. Fournier, Y.; Barras, A.; Boutinard Rouelle, G.; Maeder, T.; Ryser, P. SMD pressure and flow sensors for industrial compressed air in LTCC technology. In Proceedings of the 17th IMAPS European Microelectronics and Packaging Conference(EMPC), Rimini, Italy,2009; paper 17-S3-8.
25. Birol, H.; Maeder, T.; Ryser, P. Modification of Thick-film Conductors Used in IP Technology for Reduction of Warpage during Co-firing of LTCC (Low Temperature Co-fired Ceramic) Modules. Key Eng. Mat. 2006, High Performance Ceramics IV, 746-749.
26. Fournier, Y.; Bieri, L.-S.; Maeder, T.; Ryser, P. Influence of lamination parameters on LTCC shrinkage under unconstrained sintering. In Proceedings of the 4th IMAPS European Microelectronics and Packaging Symposium (EMPS), Terme Čatež, Slovenia, 2006; pp. 165-170.
27. Kellis, D.L.; Moll, A.J.; Plumlee, D.G. Effects of silver paste application on embedded channels in low temperature co-fired ceramics. J. Microelectron. Electron. Packag. 2009, 6, 54-58.