A post-bonding-free fabrication of integrated microfluidic devices for mass spectrometry applications

Sensors and Actuators, B: Chemical

Volumn 156, Issue 1, 2011, Pages 156-161

  Kuo, Shu Ming ^a   Yang, Chao Chi ^a   Shiea, Jentaie ^a   Lin, Che Hsin ^a  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

Author keywords

Mass spectrum; Micro plasma; Microfluidic; UV epoxy

Indexed keywords

BONDING ADHESIVE; BONDING PROCESS; CHEMICAL SAMPLES; EMBEDDED ELECTRODES; ESTERIFICATION REACTIONS; HIGH TEMPERATURE; IN-CHANNELS; INTEGRATED MICROFLUIDIC DEVICES; LABEL FREE; LITHOGRAPHY PROCESS; MASS-SPECTRUM; MICRO DEVICES; MICRO-PLASMAS; MICRO-REACTOR; MICROCHIP DEVICES; MICROFLUIDIC CHANNEL; MICROFLUIDIC STRUCTURES; NOVEL PROCESS; SIMPLE APPROACH; STRUCTURAL MATERIALS; UV EPOXY; UV GLUE; UV-CURABLE RESINS; VACUUM SUCTION;

CHEMICAL DETECTION; ELECTRODES; ESTERIFICATION; FABRICATION; FLUIDIC DEVICES; GLUES; GLUING; INTEGRATION; LITHOGRAPHY; MASS SPECTROMETRY; MICROPROCESSOR CHIPS; RESINS; SUBSTRATES;

MICROFLUIDICS;

EID: 79957820453     PISSN: 09254005     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.snb.2011.04.004     Document Type: Article

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