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Volumn , Issue , 2007, Pages 66-69
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The performance of various solder ball under high shear speed test
a
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Author keywords
[No Author keywords available]
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Indexed keywords
ARSENIC COMPOUNDS;
BRAZING;
BRITTLE FRACTURE;
CHLORINE COMPOUNDS;
COPPER;
COPPER ALLOYS;
FAILURE ANALYSIS;
FRACTURE;
FRACTURE FIXATION;
GERMANIUM;
INTERMETALLICS;
LEAD;
LEAD ALLOYS;
METALS;
MICROSYSTEMS;
NICKEL;
QUALITY ASSURANCE;
RELIABILITY;
SILVER;
SOLDERED JOINTS;
SOLDERING;
SOLDERING ALLOYS;
SPEED;
STRENGTH OF MATERIALS;
TECHNOLOGY;
TESTING;
TIN;
TIN ALLOYS;
TITANIUM COMPOUNDS;
WELDING;
ALLOY COMPOSITIONS;
BALL-GRID ARRAYS;
FRACTURE BEHAVIORS;
FRACTURE FEATURES;
FRACTURE SURFACES;
HIGH SHEAR;
INTERFACE FRACTURE;
INTERMETALLIC COMPOUNDS;
LEAD-FREE;
LEAD-FREE SOLDER;
LEAD-FREE SOLDER JOINTS;
SHEAR BEHAVIOR;
SHEAR SPEED;
SHEAR TESTING;
SN-37PB;
SN-PB SOLDER;
SOLDER BALLS;
SOLDER JOINTS;
SHEAR STRENGTH;
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EID: 48649102009
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/IMPACT.2007.4433569 Document Type: Conference Paper |
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Times cited : (9)
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References (8)
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