Control of thickness and morphology of thin alumina films deposited via Pulsed Chemical Vapor Deposition (Pulsed CVD) through variation of purge times

Surface and Coatings Technology

Volumn 205, Issue 17-18, 2011, Pages 4177-4182

  Roy, Amit K ^a   Goedel, Werner A ^a  

^a CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Alumina coating; Deposition rate; Low temperature deposition; Thin film deposition; Trimethylaluminum

Indexed keywords

ALUMINA COATING; CONFORMAL FILMS; CONFORMALITY; DEPOSITED FILMS; DEPOSITION TEMPERATURES; FILM DEPOSITION RATES; GAS-PHASE REACTIONS; GASPHASE; GRAPHITIC CARBONS; HIGHER TEMPERATURES; LOW-TEMPERATURE DEPOSITION; NITROGEN GAS; NONUNIFORM; PULSED CVD; PUMPING SPEED; PURGE TIME; SURFACE SATURATION; THIN ALUMINA FILM; THIN FILM DEPOSITION; TRIMETHYLALUMINUM;

ATOMIC LAYER DEPOSITION; CARBON FIBERS; CARBON FILMS; CHEMICAL VAPOR DEPOSITION; COATINGS; DEPOSITION RATES; FIBERS; GASES; MONOLAYERS; MORPHOLOGY; NITROGEN; THIN FILMS; WATER VAPOR;

DEPOSITION;

EID: 79955100488     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2011.03.009     Document Type: Article

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