Effect of the deposition parameters on the voiding propensity of solder joints with Cu electroplated in a Hull cell

Journal of Applied Electrochemistry

Volumn 41, Issue 4, 2011, Pages 469-480

  Wafula, F ^a   Liu, Y ^a   Yin, L ^b   Borgesen, P ^c   Cotts, E J ^a   Dimitrov, N ^a  

^a BINGHAMTON UNIVERSITY   (United States)

^b UNIVERSAL INSTRUMENTS CORPORATION   (United States)

^c State University of New York   (United States)

Author keywords

Cu electroplating; Hull cell; Impurity incorporation; Solder joints; Voiding

Indexed keywords

CU ELECTROPLATING; HULL CELL; IMPURITY INCORPORATION; SOLDER JOINTS; VOIDING;

CATHODES; POLYETHYLENE GLYCOLS; POLYETHYLENE OXIDES; ROTATING DISKS;

ELECTROPLATING;

EID: 79954610457     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10800-011-0257-4     Document Type: Article

References (22)

1. Chiu T, Zeng K, Stierman R et al (2004) In: The proceedings of the 54th electronic components and technology conference. IEEE, p 1256
2. K Zeng R Stierman T Chiu, et al. 2005 J Appl Phys 97 024508 10.1063/1.1839637 (Pubitemid 40183072)
3. TT Mattila JK Kivilahti 2005 J Electron Mater 35 250 10.1007/BF02692443
4. Borgesen P, Yin L, Kondos P et al (2007) In: The proceedings of the 57th electronic components and technology conference. IEEE, p 136
5. PC Andricacos C Uzoh JO Dukovic, et al. 1998 IBM J Res Dev 42 567 10.1147/rd.425.0567 1:CAS:528:DyaK1cXmt1Kjsbc%3D
6. TP Moffat D Wheeler MD Edelstein, et al. 2005 IBM J Res Dev 49 19 10.1147/rd.491.0019 1:CAS:528:DC%2BD2MXhs1Wrtr8%3D
7. Yin L, Kondos P, Borgesen P et al (2009) In: The proceedings of the 59th electronic components and technology conference. IEEE, p 406
8. JY Kim J Yu SH Kim 2009 Acta Mater 57 5001 10.1016/j.actamat.2009.06.060 1:CAS:528:DC%2BD1MXhtFWlu7nI
9. T Laurila V Vuorinen JK Kivilahti 2005 Mater Sci Eng 49 1 10.1016/j.mser.2005.03.001 (Pubitemid 40788671)
10. W Yang RW Messler 1994 J Electron Mater 23 765 10.1007/BF02651371 1:CAS:528:DyaK2cXltl2hsrY%3D
11. J Yu JY Kim 2008 Acta Mater 56 5514 10.1016/j.actamat.2008.07.022 1:CAS:528:DC%2BD1cXht1yrs7fM
12. JY Kim J Yu 2008 Appl Phys Lett 92 092109 10.1063/1.2890072 (Pubitemid 351357389)
13. Y Liu J Wang L Yin, et al. 2008 J Appl Electrochem 38 1695 10.1007/s10800-008-9618-z 1:CAS:528:DC%2BD1cXhtlens7%2FM
14. Liu Y, Yin L, Bliznakov S et al (2010) IEEE Trans Compon Packag Technol 33:127
15. F Wafula Y Liu L Yin, et al. 2010 J Electrochem Soc 157 D111 10.1149/1.3271129 1:CAS:528:DC%2BC3cXitlyltg%3D%3D
16. PM Vereecken RA Binstead H Deligianni, et al. 2005 IBM J Res Dev 49 3 10.1147/rd.491.0003 1:CAS:528:DC%2BD2MXhs1Wrtr4%3D
17. C Gabrielli P Mocoteguy H Perrot, et al. 2007 J Electrochem Soc 154 D13 10.1149/1.2364831 1:CAS:528:DC%2BD2sXht1yjtQ%3D%3D (Pubitemid 44866322)
18. F Wafula Y Liu L Yin, et al. 2009 ECS Trans 19 43 10.1149/1.3246597 1:CAS:528:DC%2BD1MXhsValsL7J
19. MB Vukmirovic N Vasiljevic N Dimitrov, et al. 2003 J Electrochem Soc 150 B10 10.1149/1.1526554 1:CAS:528:DC%2BD38XpvVeiurY%3D
20. TP Moffat D Wheeler D Josell 2004 J Electrochem Soc 151 C262 10.1149/1.1651530 1:CAS:528:DC%2BD2cXitFSksr4%3D
21. RO Hull 1939 Proc Am Electroplat Soc 27 52
22. Schlesinger M, Paunovic M (2000) Modern electroplating, 4th edn. Wiley Interscience, New York, pp 14-16