Understanding, controlling and minimizing the voiding, sporadically occurring in solder joints with electroplated copper

ECS Transactions

Volumn 19, Issue 24, 2009, Pages 43-56

  Wafula, F ^a   Liu, Y ^a   Yin, L ^b   Bliznakov, S ^a   Borgesen, P ^a   Cotts, E J ^a,c   Dimitrov, N ^a  

^a BINGHAMTON UNIVERSITY   (United States)

^b State University of New York at Binghamton   (United States)

^c UNIVERSAL INSTRUMENTS CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER PLATING; ELECTRODEPOSITION; ELECTRODES; LEAD-FREE SOLDERS;

ELECTRONIC DEVICE; ELECTROPLATED COPPER; IMPURITY INCORPORATION; OVER POTENTIAL; PLATING RATES; PREDICTION AND CONTROL; SOLDER JOINTS; VOID FORMATION;

COPPER;

EID: 79954570845     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.3246597     Document Type: Conference Paper

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