Above-IC generic poly-SiGe thin film wafer level packaging and MEM device technology: Application to accelerometers

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2011, Pages 352-355

  Guo, B ^a   Wen, L ^b   Helin, P ^a   Claes, G ^a   Verbist, A ^a   Van Hoof, R ^a   Du Bois, B ^a   De Coster, J ^a   De Wolf, I ^a   HadiShahar, A ^a   Li, Y ^a   Cui, H ^a   Lux, M ^a   Vereecke, G ^a   Tilmans, H A C ^a   Haspeslagh, L ^a   Decoutere, S ^a   Osman, H ^a   Puers, R ^b   Severi, S ^a   Witvrouw, A ^a   more..

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

DEVICE TECHNOLOGIES; ELECTRO-MECHANICAL; HERMETICITY; IN-VACUUM; N2 ATMOSPHERES; PLATFORM TECHNOLOGY; POLY-SIGE THIN FILMS; REFERENCE DEVICES; STANDARD CMOS; WAFER LEVEL PACKAGING;

ACCELEROMETERS; BIOLOGICAL ORGANS; MECHANICAL ENGINEERING; MECHANICS; MEMS; REACTIVE ION ETCHING; SEMICONDUCTING SILICON COMPOUNDS; SILICON ALLOYS; THIN FILMS; VAPOR DEPOSITION;

PACKAGING;

EID: 79953770734     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2011.5734434     Document Type: Conference Paper

References (11)

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