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Volumn 2, Issue , 2003, Pages 1899-1902
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Thin film encapsulation of acceleration sensors using polysilicon sacrificial layers
a a a a a a a a b b c c |
Author keywords
Acceleration; Accelerometers; CMOS process; Encapsulation; Etching; Microelectromechanical devices; Micromechanical devices; Protection; Silicon; Thin film sensors
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Indexed keywords
ACCELERATION;
ACCELEROMETERS;
ACTUATORS;
CMOS INTEGRATED CIRCUITS;
ENCAPSULATION;
ETCHING;
MECHANICAL STABILITY;
MICROELECTROMECHANICAL DEVICES;
MICROSYSTEMS;
POLYCRYSTALLINE MATERIALS;
POLYSILICON;
SILICON;
SILICON WAFERS;
THIN FILMS;
TRANSDUCERS;
ACCELERATION SENSORS;
CMOS PROCESSS;
MICROMECHANICAL DEVICE;
PROTECTION;
SACRIFICIAL ETCHING;
THIN FILM ENCAPSULATION;
THIN FILM SENSORS;
WAFER-LEVEL ENCAPSULATION;
SOLID-STATE SENSORS;
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EID: 33847617690
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/SENSOR.2003.1217162 Document Type: Conference Paper |
Times cited : (16)
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References (5)
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