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Volumn 2, Issue , 2003, Pages 1899-1902

Thin film encapsulation of acceleration sensors using polysilicon sacrificial layers

Author keywords

Acceleration; Accelerometers; CMOS process; Encapsulation; Etching; Microelectromechanical devices; Micromechanical devices; Protection; Silicon; Thin film sensors

Indexed keywords

ACCELERATION; ACCELEROMETERS; ACTUATORS; CMOS INTEGRATED CIRCUITS; ENCAPSULATION; ETCHING; MECHANICAL STABILITY; MICROELECTROMECHANICAL DEVICES; MICROSYSTEMS; POLYCRYSTALLINE MATERIALS; POLYSILICON; SILICON; SILICON WAFERS; THIN FILMS; TRANSDUCERS;

EID: 33847617690     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2003.1217162     Document Type: Conference Paper
Times cited : (16)

References (5)
  • 1
  • 2
    • 0035341519 scopus 로고    scopus 로고
    • Polysilicon Vibrating Gyroscope Vacuum-Encapsulated In An On-Chip Micro Chamber
    • Tsuchiya et al. 'Polysilicon Vibrating Gyroscope Vacuum-Encapsulated In An On-Chip Micro Chamber', Sensors and Actuators A, 90 (2001) 49
    • (2001) Sensors and Actuators A , vol.90 , pp. 49
    • Tsuchiya1
  • 5
    • 85072444547 scopus 로고    scopus 로고
    • Acceleration Sensor In Surface Micromachining For Airbag applications With High Signal/Noise Ratio
    • 960758
    • Offenberg et al., 'Acceleration Sensor In Surface Micromachining For Airbag applications With High Signal/Noise Ratio', SAE Technical Paper Series, 960758 (1996) 35
    • (1996) SAE Technical Paper Series , pp. 35
    • Offenberg1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.